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企業・研究機関Company / Institute · アメリカUSA · 2022–2026 LIVE

AMD

アメリカUSA 13位 (12 pt) · 世界World 28位 (0 pt) · 対象論文Papers 13

年別の推移Papers per year

会議・論文誌別の論文数(フルカウント)Papers per venue (full count)

012342022 ISSCC: 2220222023 ISSCC: 3320232024 ISSCC: 22024 VLSI: 12024 JSSC: 1420242025 ISSCC: 2220252026 ISSCC: 12026 VLSI: 122026
ISSCCVLSIJSSC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC23221
VLSI––1–1
JSSC––1––

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 11086.97アメリカUSA #4 · 世界World #11
VLSI Tier 1221.11アメリカUSA #11 · 世界World #28
JSSC Tier 1110.08アメリカUSA #25 · 世界World #99
CICC Tier 2000.00–
A-SSCC Tier 2000.00–
ESSERC Tier 2000.00–

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. ISSCC
    2026
    2.1 AMD Instinct MI350 Series GPUs: CDNA 4-Based 3D-Stacked 3nm XCDs and 6nm IODs for AI Applications
    DOI
    Ramasamy Adaikkalavan, Alan Smith, Teja Singh, Sundar Rangarajan, Eric Chapman, Samuel Naffziger, Subramaniam Maiyuran, Candy Chen, Sriram Sundaram, Mark Silla, Duncan Law, Kathy Hoover, Samuel Lipson, Kevin Duda, Vinay Parthasarathy, Deepesh John, Hanish Vemulapalli, Srinivas Pavan Kumar Gade
    AMD · AMD
  2. VLSI
    2026
    Architecture Partitioning and Optimization in the Era of Chiplet Computing
    DOI
    Vamsi Krishna Alla, Alan Smith, Tyrone Huang, Alexander Kaganov, Wonjun Jung, Michael Steffen
    AMD · AMD
  3. ISSCC
    2025
    36.1 A 32Gb/s 10.5Tb/s/mm 0.6pJ/b UCIe-Compliant Low-Latency Interface in 3nm Featuring Matched-Delay for Dynamic Clock Gating
    DOI
    Mu-Shan Lin, Chien-Chun Tsai, Shenggao Li, Wei-Chih Chen, Wen-Hung Huang, Yu-Chi Chen, Yu-Jie Huang, Alan Drake, Chin-Hua Wen, Paul Ranucci, Hsin-Hung Kuo, Aidong Yin, Shu-Chun Yang, Farsheed Mahmoudi, Han-Tzung Ke, Chao-Chieh Li, Nai-Chen Cheng, Jimmy Wang, Kevin Lin, Harry Liao, Jie-Ren Huang, Meng-Hsuan Wu, Kenny Cheng-Hsiang Hsieh, Nicholas Amatruda, William Polanco, David King, Todd Basso, Anwar Kashem
    TSMC · TSMC · TSMC · AMD
  4. ISSCC
    2025
    “Zen 5”: The AMD High-Performance 4nm x86-64 Microprocessor Core
    DOI
    Teja Singh, Spence Oliver, Sundar Rangarajan, Shane Southard, Carson Henrion, Alex Schaefer, Brett Johnson, Sarah Bartaszewicz Tower, Kathy Hoover, Deepesh John, Ted Antoniadis, Shravan Lakshman, Vibhor Mittal, Brian Kasprzyk, Ross McCoy, Kurt Mohlman, Anitha Mohan, Hon-Hin Wong, Daryl Lieu, Russell Schreiber, Sahilpreet Singh, Nick Lance, Darryl Prudich, Justin Coppin, Tim Jackson, Anita Karegar, Ryan Miller, Sabeesh Balagangadharan, James Pistole, Wilson Li, Michael McCabe
    AMD · AMD
  5. ISSCC
    2024
    11.1 AMD InstinctTM MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems
    DOI
    Alan Smith, Eric Chapman, Chintan Patel, Raja Swaminathan, John Wuu, Tyrone Huang, Wonjun Jung, Alexander Kaganov, Hugh McIntyre, Ramon Mangaser
    AMD · AMD
  6. ISSCC
    2024
    2.2 “Zen 4c”: The AMD 5nm Area-Optimized ×86-64 Microprocessor Core
    DOI
    Thomas Burd, Srividhya Venkataraman, Wilson Li, Timothy Johnson, Jerry Lee, Srikirti Velaga, Mark Wasio, Thomas Yiu, Franklin Bodine, Michael McCabe, Udin Salim, Santosh Kumar Thouta, Michael Golden, Sowmya Ramachandran, Gokul Subramani Lakshmi Devi, John Wuu, Yarek Kuszczak, Gaurav Singla, Carson Henrion, Andy Robison, Sabeesh Balagangadharan, Umesh Nair, Naveen Srivastava, Hari Prasad, Mohini Polimetla, Phaneendra Chennupati, Eshwar Gupta, Mahesh Vykuntam, Sumantra Sarkar, Praveen Kumar Duvvuru, Theja Mardi, G Swetha
    AMD · AMD
  7. JSSC
    2024
    FreFlex: A High-Performance Processor for Convolution and Attention Computations via Sparsity-Adaptive Dynamic Frequency Boosting
    DOI
    Sadhana Shanmuga Sundaram, Yugandhar Khodke, Yidong Li, Sung-Joon Jang, Sang-Seol Lee, Mingu Kang
    University of California San Diego · AMD · NVIDIA · Korea Electronics Technology Institute
  8. VLSI
    2024
    AMD Instinct™ MI300X Accelerator: Packaging and Architecture Co-Optimization
    DOI
    Alan Smith, Gabriel H. Loh, John Wuu, Samuel Naffziger, Tyrone Huang, Hugh McIntyre, Ramon Mangaser, Wonjun Jung, Raja Swaminathan
    AMD · AMD
  9. ISSCC
    2023
    1.1 Innovation For the Next Decade of Compute Efficiency
    DOI
    Lisa Su, Sam Naffziger
    AMD
  10. ISSCC
    2023
    A O.96pJ/b 7 × 50Gb/s-per-Fiber WDM Receiver with Stacked 7nm CMOS and 45nm Silicon Photonic Dies
    DOI
    Mayank Raj, Chuan Xie, Ade Bekele, Adam Chou, Wenfeng Zhang, Ying Cao, Jae Wook Kim, Nakul Narang, Hongyuan Zhao, Yipeng Wang, Kee Hian Tan, Winson Lin, Jay Im, David Mahashin, Santiago Asuncion, Parag Upadhyaya, Yohan Frans
    AMD · AMD
  11. ISSCC
    2023
    “Zen 4”: The AMD 5nm 5.7GHz x86-64 Microprocessor Core
    DOI
    Benjamin Munger, Kathy Wilcox, Jeshuah Sniderman, Chuck Tung, Brett Johnson, Russell Schreiber, Carson Henrion, Kevin Gillespie, Tom Burd, Harry Fair, David Johnson, Jonathan White, Scott McLelland, Steven Bakke, Javin Olson, Ryan McCracken, Matthew Pickett, Aaron Horiuchi, Hien Nguyen, Tim H Jackson
    AMD
  12. ISSCC
    2022
    3D V-Cache: the Implementation of a Hybrid-Bonded 64MB Stacked Cache for a 7nm x86-64 CPU
    DOI
    John Wuu, Rahul Agarwal, Michael Ciraula, Carl Dietz, Brett Johnson, Dave Johnson, Russell Schreiber, Raja Swaminathan, Will Walker, Samuel Naffziger
    AMD
  13. ISSCC
    2022
    Zen3: The AMD 2nd-Generation 7nm x86-64 Microprocessor Core
    DOI
    Thomas Burd, Wilson Li, James Pistole, Srividhya Venkataraman, Michael McCabe, Timothy Johnson, James Vinh, Thomas Yiu, Mark Wasio, Hon-Hin Wong, Daryl Lieu, Jonathan White, Benjamin Munger, Joshua Lindner, Javin Olson, Steven Bakke, Jeshuah Sniderman, Carson Henrion, Russell Schreiber, Eric Busta, Brett Johnson, Tim Jackson, Aron Miller, Ryan Miller, Matthew Pickett, Aaron Horiuchi, Josef Dvorak, Sabeesh Balagangadharan, Sajeesh Ammikkallingal, Pankaj Kumar
    AMD