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企業・研究機関Company / Institute · アメリカUSA · 2022–2026 LIVE

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アメリカUSA 8位 (19 pt) · 世界World 28位 (0 pt) · 対象論文Papers 18

年別の推移Papers per year

会議・論文誌別の論文数（フルカウント）Papers per venue (full count)

01234562022 VLSI: 22022 JSSC: 22022 ESSERC: 1520222023 VLSI: 22023 JSSC: 12023 CICC: 12023 ESSERC: 1520232024 ISSCC: 22024 VLSI: 12024 JSSC: 3620242025 ISSCC: 12025 JSSC: 1220252026
ISSCCVLSIJSSCCICCESSERC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC––21–
VLSI221––
JSSC2131–
CICC–1–––
ESSERC11–––

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 1321.38アメリカUSA #13 · 世界World #42
VLSI Tier 1532.64アメリカUSA #6 · 世界World #14
JSSC Tier 1700.98アメリカUSA #9 · 世界World #25
CICC Tier 2100.09アメリカUSA #7 · 世界World #22
A-SSCC Tier 2000.00–
ESSERC Tier 2200.53アメリカUSA #4 · 世界World #28

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. ISSCC
    2025
    6.4 A 400×400 3.24µm 117dB-Dynamic-Range 3-Layer Stacked Digital Pixel Sensor
    DOI
    Tsung-Hsun Tsai, Kwuang-Han Chang, Andrew Berkovich, Raffaele Capoccia, Song Chen, Zhao Wang, Chiao Liu, Yi-Hsuan Lin, Sheng-Yeh Lai, Hao-Ming Hsu, Hirofumi Abe, Kazuya Mori, Hideyuki Fukuhara, Chih-Hao Lin, Toshiyuki Isozaki, Wei-Chen Li, Wei-Fan Chou, Masayuki Uno, Rimon Ikeno, Masato Nagamatsu, Guang Yang, Shou-Gwo Wuu, Lyle Bainbridge
    Meta · ブリルニクスBrillnics
  2. JSSC
    2025
    A 3.96-μm, 124-dB Dynamic-Range, Digital-Pixel Sensor With Triple- and Single-Quantization Operations for Monochrome and Near-Infrared Dual-Channel Global Shutter Operation
    DOI
    Ken Miyauchi, Masayuki Uno, Toshiyuki Isozaki, Hideyuki Fukuhara, Kazuya Mori, Hirofumi Abe, Masato Nagamatsu, Rimon Ikeno, Isao Takayanagi, Hsin-Li Chen, Chih-Hao Lin, Wen-Chien Fu, Shou-Gwo Wuu, Song Chen, Lyle Bainbridge, Qing Chao, Ramakrishna Chilukuri, Wei Gao, Andrew P. Hammond, Tsung-Hsun Tsai, Chiao Liu
    ブリルニクスBrillnics · Meta
  3. ISSCC
    2024
    11.2 A 3D integrated Prototype System-on-Chip for Augmented Reality Applications Using Face-to-Face Wafer Bonded 7nm Logic at <2μm Pitch with up to 40% Energy Reduction at Iso-Area Footprint
    DOI
    Tony F. Wu, Huichu Liu, H. Ekin Sumbul, Lita Yang, Dipti Baheti, Jeremy Coriell, William Koven, Anu Krishnan, Mohit Mittal, Matheus Trevisan Moreira, Max Waugaman, Laurent Ye, Edith Beigné
    Meta
  4. ISSCC
    2024
    33.9 A Miniature Neural Interface Implant with a 95% Charging Efficiency Optical Stimulator and an 81.9dB SNDR ΔΣM-Based Recording Frontend
    DOI
    Linran Zhao, Wei Shi, Yan Gong, Xiang Liu, Wen Li, Yaoyao Jia
    The University of Texas at Austin · Meta · Michigan State University
  5. JSSC
    2024
    A Wireless Sensor-Brain Interface System for Tracking and Guiding Animal Behaviors Through Closed-Loop Neuromodulation in Water Mazes
    DOI
    Yuhan Hou, Yi Zhu, Xing Ji, Andrew G. Richardson, Xilin Liu
    University of Toronto · Synaptive (Canada) · Meta · University of Pennsylvania · University Health Network · KITE Research Institute
  6. JSSC
    2024
    AIMMI: Audio and Image Multi-Modal Intelligence via a Low-Power SoC With 2-MByte On-Chip MRAM for IoT Devices
    DOI
    Zichen Fan, Qirui Zhang, Hyochan An, Boxun Xu, Li Xu, Chien-Wei Tseng, Yimai Peng, Andrea Bejarano-Carbo, Pierre Abillama, Ang Cao, Bowen Liu, Changwoo Lee, Zhehong Wang, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan · Apple · University of California, Santa Barbara · NVIDIA · Meta
  7. JSSC
    2024
    RoboVisio: A Micro-Robot Vision Domain-Specific SoC for Autonomous Navigation Enabling Fully-on-Chip Intelligence via 2-MB eMRAM
    DOI
    Qirui Zhang, Zichen Fan, Hyochan An, Zhehong Wang, Ziyun Li, Guanru Wang, Pierre Abillama, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan · Apple · Meta · Cisco Systems (United States)
  8. VLSI
    2024
    A 512×512 SPAD Laser Speckle Autocorrelation Imager in Stacked 65/40nm CMOS
    DOI
    Francescopaolo Mattioli Della Rocca, Edbert J. Sie, Ahmet T. Erdogan, Lars Fisher, Andrew B. Matheson, Neil Finlayson, Alistair Gorman, Istvan Gyongy, Hanning Mai, Thierry Lachaud, Russell Forsyth, Francesco Marsili, Robert K. Henderson
    University of Edinburgh · Meta
  9. CICC
    2023
    A 1-MHz-Bandwidth Continuous-Time Delta-Sigma ADC Achieving >90dB SFDR and >80dB Antialiasing Using Reference-Switched Resistive Feedback DACs
    DOI
    Sharvil Patil, Raviteja Theertham, Hajime Shibata, Victor Kozlov, Asha Ganesan, Efram Burlingame, Zhao Li, Rama Thakar, Qianqian Zhang, Yue Yin, Aathreya Bhat
    Analog Devices · Meta · NVIDIA
  10. ESSERC
    2023
    Siracusa: A Low-Power On-Sensor RISC-V SoC for Extended Reality Visual Processing in 16nm CMOS
    DOI
    Moritz Scherer, Manuel Eggimann, Alfio Di Mauro, Arpan Suravi Prasad, Francesco Conti, Davide Rossi, Jorge Tomás Gómez, Ziyun Li, Syed Shakib Sarwar, Zhao Wang, Barbara De Salvo, Luca Benini
    ETH Zurich · University of Bologna · Meta
  11. JSSC
    2023
    A Portable CMOS-Based Spin Resonance System for High-Resolution Spectroscopy and Imaging
    DOI
    Daniel Krüger, Aoyang Zhang, Behdad Aghelnejad, Henry Hinton, Victor Marrugat Arnal, Yi-Qiao Song, Yiqiao Tang, Ka-Meng Lei, Jens Anders, Donhee Ham
    University of Stuttgart · Harvard University · Oxford Instruments (United Kingdom) · ETH Zurich · Meta · University of Macau
  12. VLSI
    2023
    A 3.96μm, 124dB Dynamic Range, 6.2mW Stacked Digital Pixel Sensor with Monochrome and Near-Infrared Dual-Channel Global Shutter Capture
    DOI
    Song Chen, Chiao Liu, Lyle Bainbridge, Qing Chao, Ramakrishna Chilukuri, Wei Gao, Andrew P. Hammond, Tsung-Hsun Tsai, Ken Miyauchi, Isao Takayanagi, Masato Nagamatsu, Hirofumi Abe, Kazuya Mori, Masayuki Uno, Toshiyuki Isozaki, Rimon Ikeno, Hsin-Li Chen, Chih-Hao Lin, Wen-Chien Fu, Shou-Gwo Wuu
    Meta · ブリルニクスBrillnics
  13. VLSI
    2023
    A prototype 5nm custom sensor SoC for Augmented Reality/Virtual Reality targeting Smartglasses with embedded computer vision, audio, security and ML
    DOI
    Karl Kaiser, Dinesh Patil, Edith Beigne
    Meta
  14. ESSERC
    2022
    A Portable CMOS-based MRI System with 67×67×83 µm3Image Resolution
    DOI
    Daniel Kruger, Aoyang Zhang, Henry Hinton, Victor M. Arnal, Yi-Qiao Song, Yiqiao Tang, Ka-Meng Lei, Jens Anders, Donhee Ham
    University of Stuttgart · Harvard University · Meta · University of Macau
  15. JSSC
    2022
    CHIMERA: A 0.92-TOPS, 2.2-TOPS/W Edge AI Accelerator With 2-MByte On-Chip Foundry Resistive RAM for Efficient Training and Inference
    DOI
    Kartik Prabhu, Albert Gural, Zainab F. Khan, Robert M. Radway, Massimo Giordano, Kalhan Koul, Rohan Doshi, John W. Kustin, Timothy Liu, Gregorio B. Lopes, Victor Turbiner, Win-San Khwa, Yu-Der Chih, Meng-Fan Chang, Guenole Lallement, Boris Murmann, Subhasish Mitra, Priyanka Raina
    Stanford University · TSMC · Meta
  16. JSSC
    2022
    High-Efficiency Class-E Power Amplifiers for mmWave Radar Sensors: Design and Implementation
    DOI
    Tolga Dinc, Sachin Kalia, Siraj Akhtar, Baher Haroun, Benjamin Cook, Swaminathan Sankaran
    Texas Instruments · Meta
  17. VLSI
    2022
    Co-Optimization of SRAM Circuits with Sequential Access Patterns in a 7nm SoC Achieving 58% Memory Energy Reduction for AR Applications
    DOI
    Daniel H Morris, Huichu Liu, Tony F Wu, H Ekin Sumbul, Elnaz Ansari, Alexandre Barachant, Jonathan Reid, Edith Beigne
    Meta
  18. VLSI
    2022
    i-FlatCam: A 253 FPS, 91.49 µJ/Frame Ultra-Compact Intelligent Lensless Camera for Real-Time and Efficient Eye Tracking in VR/AR
    DOI
    Yang Zhao, Ziyun Li, Yonggan Fu, Yongan Zhang, Chaojian Li, Cheng Wan, Haoran You, Shang Wu, Xu Ouyang, Vivek Boominathan, Ashok Veeraraghavan, Yingyan Lin
    Rice University · Meta