-
CICC
2026
DOI
Mohammad Mahdi Ghahramani, Srujan Kumar Kaile, Gijin Park, Chiho Song, Yuanming Zhu, Il-Min Yi, Sebastian Hoyos, Samuel Palermo
Texas A&M University · Gwangju Institute of Science and Technology
-
CICC
2026
DOI
Tanwei Yan, Zhiyong Zhang, Junning Jiang, Scott L. Miller, Jose Silva-Martinez
Texas A&M University
-
JSSC
2026
DOI
Tony Chan Carusone, Timothy O. Dickson, Samuel Palermo, Sudip Shekhar, Mozhgan Mansuri
IBM · Texas A&M University · University of British Columbia · Intel
-
ESSERC
2025
DOI
Inhyun Kim, Hyungryul Kang, Ruida Liu, Ankur Kumar, Yuan Yuan, Dharma Paladugu, Hyeonseok Lee, Zhihong Huang, Chaerin Hong, Marco Fiorentino, Raymond Beausoleil, Samuel Palermo
Texas A&M University · Hewlett-Packard (United States) · Hewlett Packard Enterprise (United States)
-
ESSERC
2025
DOI
Inhyun Kim, Hyeonseok Lee, Ankur Kumar, Mingi Yeo, David Dolt, Taeyang Sim, Seongkwan Lee, Cheolmin Park, Minho Kang, Jun Yeon Won, Jaemoo Choi, Jaeduk Han, Samuel Palermo
Texas A&M University · Samsung · Hanyang University
-
VLSI
2025
DOI
Mohammad Mahdi Ghahramani, Srujan Kumar Kaile, Gijin Park, Yuanming Zhu, Il-Min Yi, Sebastian Hoyos, Samuel Palermo
Texas A&M University · Gwangju Institute of Science and Technology
-
A-SSCC
2024
DOI
Srujan Kumar Kaile, Julian Camilo Gomez Diaz, Yuanming Zhu, Ii-Min Yi, Sebastian Hoyos, Samuel Palermo
Texas A&M University · Gwangju Institute of Science and Technology
-
ESSERC
2024
DOI
Mingi Yeo, David Dolt, Yu-Lun Luo, David Reents, Samuel Palermo
Texas A&M University
-
ESSERC
2024
DOI
Ankur Kumar, Yuan Yuan, Ruida Liu, Zhihong Huang, Inhyun Kim, Marco Fiorentino, Raymond Beausoleil, Samuel Palermo
Texas A&M University · Hewlett Packard Enterprise (United States)
-
JSSC
2024
DOI
Il-Min Yi, Srujan Kumar Kaile, Yuanming Zhu, Julian Camilo Gomez Diaz, Sebastian Hoyos, Samuel Palermo
Gwangju Institute of Science and Technology · Texas A&M University
-
JSSC
2024
DOI
David Dolt, Samuel Palermo
Texas A&M University
-
ISSCC
2023
DOI
Fatemeh Aghimand, Chelsea Hu, Saransh Sharma, Krishna K. Pochana, Richard M. Murray, Azita Emami
California Institute of Technology · Texas A&M University
-
JSSC
2023
DOI
Ahmad Khairi, Yoel Krupnik, Amir Laufer, Yoav Segal, Marco Cusmai, Itamar Levin, Ari Gordon, Yaniv Sabag, Vitali Rahinski, Idan Lotan, Gadi Ori, Noam Familia, Stas Litski, Tali Warshavsky Grafi, Udi Virobnik, Dror Lazar, Yeshayahu Horwitz, Ajay Balankutty, Shiva Kiran, Samuel Palermo, Peng Mike Li, Frank O'Mahony, Ariel Cohen
Intel · Intel · Texas A&M University
-
JSSC
2023
DOI
Yuanming Zhu, Tong Liu, Srujan Kumar Kaile, Shiva Kiran, Il-Min Yi, Ruida Liu, Julian Camilo Gomez Diaz, Sebastian Hoyos, Samuel Palermo
Texas A&M University
-
JSSC
2023
DOI
Yuanming Zhu, Julian Camilo Gomez Diaz, Srujan Kumar Kaile, Il-Min Yi, Tong Liu, Sebastian Hoyos, Samuel Palermo
Texas A&M University
-
VLSI
2023
DOI
Il-Min Yi, Srujan Kumar Kaile, Yuanming Zhu, Julian Camilo Gomez Diaz, Sebastian Hoyos, Samuel Palermo
Gwangju Institute of Science and Technology · Texas A&M University
-
VLSI
2023
DOI
Po-Hsuan Chang, Anirban Samanta, Peng Yan, Mingye Fu, Yu Zhang, Mehmet Berkay On, Ankur Kumar, Hyungryul Kang, Il-Min Yi, Dedeepya Annabattuni, David Scott, Robert Patti, Yang-Hang Fan, Yuanming Zhu, S. J. Ben Yoo, Samuel Palermo
Texas A&M University · University of California, Davis · NHanced Semiconductors (United States)
-
CICC
2022
DOI
Yuanming Zhu, Tong Liu, Srujan Kumar Kaile, Shiva Kiran, II-Min Yi, Ruida Liu, Julian Camilo Gomez Diaz, Sebastian Hoyos, Samuel Palermo
Texas A&M University
-
CICC
2022
DOI
Yuanming Zhu, Julian Camilo Gomez Diaz, Srujan Kumar Kaile, II-Min Yi, Tong Liu, Sebastian Hoyos, Samuel Palermo
Texas A&M University
-
ISSCC
2022
DOI
Yoav Segal, Amir Laufer, Ahmad Khairi, Yoel Krupnik, Marco Cusmai, Itamar Levin, Ari Gordon, Yaniv Sabag, Vitali Rahinski, Gadi Ori, Noam Familia, Stas Litski, Tali Warshavsky, Udi Virobnik, Yeshayahu Horwitz, Ajay Balankutty, Shiva Kiran, Samuel Palermo, Peng Mike Li, Ariel Cohen
Intel · Intel · Texas A&M University