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大学University · アメリカUSA · 2022–2026 LIVE

University of Michigan

アメリカUSA 1位 (77.5 pt) · 世界World 7位 (18 pt) · 対象論文Papers 103

年別の推移Papers per year

会議・論文誌別の論文数（フルカウント）Papers per venue (full count)

05101520252022 ISSCC: 42022 VLSI: 92022 JSSC: 82022 ESSERC: 32420222023 ISSCC: 22023 VLSI: 52023 JSSC: 42023 CICC: 32023 A-SSCC: 12023 ESSERC: 21720232024 ISSCC: 22024 VLSI: 32024 JSSC: 132024 ESSERC: 32120242025 ISSCC: 22025 VLSI: 82025 JSSC: 72025 ESSERC: 21920252026 ISSCC: 42026 VLSI: 72026 JSSC: 92026 CICC: 2222026
ISSCCVLSIJSSCCICCA-SSCCESSERC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC42224
VLSI95387
JSSC841379
CICC–3––2
A-SSCC–1–––
ESSERC3232–

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 1141210.89アメリカUSA #4 · 世界World #22
VLSI Tier 1323126.96アメリカUSA #1 · 世界World #2
JSSC Tier 1413629.69アメリカUSA #1 · 世界World #12
CICC Tier 2553.58アメリカUSA #12 · 世界World #42
A-SSCC Tier 2110.25アメリカUSA #7 · 世界World #71
ESSERC Tier 21098.07アメリカUSA #1 · 世界World #13

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. CICC
    2026
    A 16nm 2.2pJ/b High Efficiency Pulse-Position Modulated Resonance Transceiver for 15Mbps Multi-Source High-Speed Body-Area Sensor Network
    DOI
    Anhang Li, Ruichen Qi, Yuhao Yuan, Juan Moya, Dennis Sylvester, Mehdi Saligane
    University of Michigan · Brown University
  2. CICC
    2026
    An 11.16μJ/token Edge SLM Decoder Accelerator with Scalable Ring-based Configuration for Token-level Pipelining in 16nm FinFET
    DOI
    Guanchen Tao, Junyi Luo, Shiwei Liu, Anhang Li, Gregory Kielian, Kauna Lei, Qirui Zhang, Dennis Sylvester, Mehdi Saligane
    University of Michigan · Brown University · Google
  3. ISSCC
    2026
    2.5 A 1.1mm 2 , 14.4ns, 13.1pJ/b Forward Error Correction with Ordered-Statistics Post Processing for Ultra-Reliable and Low-Latency Communications
    DOI
    Cheng-Hsun Lu, Wei Tang, Jaehee Kim, Youngjoo Lee, Zhengya Zhang
    University of Michigan · Pohang University of Science and Technology · Korea Advanced Institute of Science and Technology
  4. ISSCC
    2026
    35.2 A 20mg Battery-Free Crystal-Less Miniaturized TX System for Flying Insects Localization with 1.45km Range
    DOI
    Yi Shen, Steve Young, Demba Komma, Ryan Strohman, Rahul Narasimha, Jeongtaek Chang, Andrea Bejarano-Carbo, Yunfan Wang, Guanren Tao, Hun-Seok Kim, David Blaauw
    University of Michigan
  5. ISSCC
    2026
    Medusa: A Quantum-Inspired 200-Variable 1016-Clause Analog k-SAT Solver
    DOI
    Luke D. Wormald, Ying-Tuan Hsu, Evangelos Dikopoulos, Wei Tang, Benjamin Datsko, Ali Hammoud, Zhengya Zhang, Michael P. Flynn
    University of Michigan
  6. ISSCC
    2026
    UniC-Vision: A 14.4Gb/s 7.3pJ/b Universal Vision Transformer OFDM Channel Estimation Accelerator for B5G/6G AI-RAN
    DOI
    Sangbu Yun, Chanhee Lee, Soonhyun Kwon, Jeongtaek Chang, Zhengya Zhang, Youngjoo Lee
    Korea Advanced Institute of Science and Technology · University of Michigan
  7. JSSC
    2026
    A 120 Frames/s CMOS Image Sensor With 8.19 TOPS/W Computing-In-Pixel for Energy-Efficient Low-Latency Face Detection
    DOI
    Hyunsoo Song, Sungjin Oh, Juan Salinas, Sung-Yun Park, Euisik Yoon
    University of Michigan
  8. JSSC
    2026
    A 175-MHz BW 60-dB SNDR 6th-Order Bandpass Cascaded Time-Interleaved Noise Shaping SAR ADC
    DOI
    Zhiyuan Zhao, Hsiang-Wen Chen, Seungheun Song, Taewook Kang, Michael P. Flynn
    University of Michigan
  9. JSSC
    2026
    A 20-mg mm-Scale Flying-Insect Localization Tag With Battery-Free Crystal-Less Burst-Mode Transmitter Achieving 1.45-km Range
    DOI
    Yi Shen, Steve Young, Demba Komma, Ryan Strohman, Rahul Narasimha, Jeongtaek Chang, Andrea Bejarano-Carbo, Yunfan Wang, Guanren Tao, Hun-Seok Kim, David Blaauw
    University of Michigan
  10. JSSC
    2026
    A 256-Point FFT Using Analog Floating-Point Computation With Post-Silicon Tuning
    DOI
    Jeongtaek Chang, Jungho Lee, Yi Shen, Sangbu Yun, Qirui Zhang, Dennis Sylvester, Hun-Seok Kim, David Blaauw
    University of Michigan · Pohang University of Science and Technology
  11. JSSC
    2026
    A Multiply-and-Accumulate SAR-ADC-Based Hybrid Slepian Beamformer
    DOI
    Zhengqi Xu, Zhiyuan Zhao, Michael A. Laun, Coleman DeLude, Justin Romberg, Michael P. Flynn
    University of Michigan · Georgia Institute of Technology
  12. JSSC
    2026
    MITTA: A Multi-Task Transformer Accelerator With Mixed Precision Structured Sparsity and Hierarchical Task-Adaptive Power Management
    DOI
    Qirui Zhang, Zichen Fan, Pierre Abillama, Sara Shoouri, Jungho Lee, Chien-Wei Tseng, Changwoo Lee, Wei Meng, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan · NVIDIA · NVIDIA
  13. JSSC
    2026
    Medusa: A Scalable Quantum-Inspired k -SAT Solver With Make and Break Feedback
    DOI
    Luke D. Wormald, Ying-Tuan Hsu, Evangelos Dikopoulos, Wei Tang, Benjamin Datsko, Ali Hammoud, Zhengya Zhang, Michael P. Flynn
    University of Michigan
  14. JSSC
    2026
    Neural-FM: Joint Neural-Network-Driven Frequency Modulation and Channel Coding With a Crystal-Less, Low-Power Connectivity Transmitter
    DOI
    Yi Shen, Boxuan Chang, Chien-Wei Tseng, Yunfan Wang, Qirui Zhang, Zichen Fan, Zhen Feng, Rahul Narasimha, Andrea Bejarano-Carbo, Hun-Seok Kim, David Blaauw
    University of Michigan
  15. JSSC
    2026
    TexCAC: A Direct-Textile-Attachable Microcontroller Integrating 2-MB MRAM for the Command and Control of Advanced Smart Textiles
    DOI
    Jacob Mack, Qirui Zhang, He Wang, Yi Shen, Jeongtaek Chang, Heejin Yang, Anjali Agrawal, Zichen Fan, Braden Desman, Zane Lewis, Thomas Farrell, David Blaauw, Will Farrell, Jim Owens, Benton H. Calhoun, Dennis Sylvester
    University of Michigan · University of Virginia
  16. VLSI
    2026
    A $5.69 ~\text{mm}^{2} 6.22 \text{Gbps}$ User-Correlation-Based Hybrid Detector for $\mathbf{1 0 2 4 \times 6 4}$ Massive MIMO Systems
    DOI
    Chen-Chien Kao, Tianyu Wei, Wei Tang, Zhengya Zhang
    University of Michigan
  17. VLSI
    2026
    A 17.6Gb/s, 39.1pJ/b Tiled Beamspace Training and Detection Processor for mmWave Massive MIMO
    DOI
    Jiyoon Han, Wei Tang, Cheng-Hsun Lu, Jungho Lee, Upamanyu Madhow, Zhengya Zhang
    University of Michigan · University of California, Santa Barbara
  18. VLSI
    2026
    A 248.5 $\text{GFLOPS}/\text{mm}^{2}$, 1.67 TFLOPS/W Streaming Processor with Hardware-Level Scheduling for Advanced Spectrum Sensing
    DOI
    Hyunwon Chung, Parin Senta, Jason Yu, Yukun Fang, Pierre Abillama, Kuan-Yu Chen, Ronald Dreslinski, David Blaauw, Hun-Seok Kim
    University of Michigan
  19. VLSI
    2026
    A 90.6 pJ/pixel 1280×800 65 fps cm-Scale Fully Integrated Video Encoder System Utilizing a 2×2 Microlens Array
    DOI
    Heejin Yang, Pierre Abillama, Xiangdong Wei, Mohammed Ashfakh Ali Huluvallay, Qirui Zhang, Junhao Chen, Jayeon Yi, Chieh-Shen Chen, Andrea Bejarano-Carbo, Michael Alexander Stankovich, Martin Lentz, Yves Bellouard, Patrick Stockton, James Friel, Andrew Trickey-Glassman, David Blaauw, Dennis Sylvester, Hun-Seok Kim
    University of Michigan · École Polytechnique Fédérale de Lausanne
  20. VLSI
    2026
    A 95.0 dB Dynamic Range Zero-Bias PV Light-to-Digital Converter for Seawater Monitoring with Single Point Calibration
    DOI
    Sanghyuck Moon, Ashfakh Huluvallay, Hyunwon Chung, Myeongsu Ko, Seokhyeon Jeong, Jungho Lee, Mohammad Khreishah, Jeongtaek Chang, Hung Do, Caitlyn Sutherland, Jason Kapit, David Nicholson, William Reinhardt, Dennis Sylvester, Mark Miskin, David Blaauw
    University of Michigan · Woods Hole Oceanographic Institution · University of Pennsylvania
  21. VLSI
    2026
    An 8-Element 200-MHz Bandwidth Oversampling Digital Slepian Beamformer
    DOI
    Zhengqi Xu, Zhiyuan Zhao, Coleman DeLude, Justin Romberg, Michael Flynn
    University of Michigan · Georgia Institute of Technology
  22. VLSI
    2026
    An 83.5dB DR, ${74}\text{pA}_{\text{RMS}}$ Neurotransmitter Sensor Interface with Drift Correction
    DOI
    Wangbo Chen, Jose R Lopez-Ruiz, Patrick McCommons, Noah Leonardo, Jill Becker, Sung-Yun Park, Michael P Flynn, Euisik Yoon
    University of Michigan
  23. ESSERC
    2025
    An Ultra-Low Power 8-PSK Receiver with Phase-Frequency Error Cancellation Using DSB Modulation
    DOI
    Aman Gupta, David Wentzloff
    University of Michigan
  24. ESSERC
    2025
    TexCAC: A 22nm 4.8mm$^2$ 18pJ/Cycle Direct-Textile-Attachable Microcontroller Integrating 2MB MRAM for the Command and Control of Advanced Smart Textiles
    DOI
    Qirui Zhang, Anjali Agrawal, Zichen Fan, Jacob Mack, Braden Desman, Zane Lewis, Thomas Farrell, David Blaauw, Will Farrell, Jim Owens, Benton H. Calhoun, Dennis Sylvester
    University of Michigan · University of Virginia
  25. ISSCC
    2025
    25.1 A Physics-Inspired Oscillator-Based Mixed-Signal Optimization Engine for Solving 50-Variable 218-Clause 3-SAT Problems with 100% Solvability and 31.7μs Solution Time
    DOI
    Evangelos Dikopoulos, Ying–Tuan Hsu, Luke Wormald, Wei Tang, Zhengya Zhang, Michael P. Flynn
    University of Michigan
  26. ISSCC
    2025
    A Crystal-Less Frequency-Modulation Transmitter IC with Joint Neural-Network-Driven Modulation and Coding for Low-Power Connectivity
    DOI
    Yi Shen, Boxuan Chang, Chien-Wei Tseng, Yunfan Wang, Qirui Zhang, Zichen Fan, Zhen Feng, Rahul Narashimha, Andrea Bejarano-Carbo, Hun-Seok Kim, David Blaauw
    University of Michigan
  27. JSSC
    2025
    A Digital-Sampling PLL With a Second-Order Noise Shaping SAR ADC Phase Detector
    DOI
    Matthew R. Belz, Zhengqi Xu, Hsiang-Wen Chen, Seungheun Song, Michael P. Flynn
    University of Michigan
  28. JSSC
    2025
    An 8-bit 20.7 TOPS/W Multilevel Cell ReRAM Macro With ADC-Assisted Bit-Serial Processing
    DOI
    Justin M. Correll, Lu Jie, Seungheun Song, Seungjong Lee, Junkang Zhu, Wei Tang, Luke Wormald, Jack Erhardt, Nicolas Breil, Roger Quon, Deepak Kamalanathan, Siddarth Krishnan, Michael Chudzik, Wei D. Lu, Zhengya Zhang, Michael P. Flynn
    University of Michigan · Applied Materials (United States)
  29. JSSC
    2025
    Analysis and Design of Broadband Terahertz Push–Push Frequency Doublers With Second Harmonic Source Tuning
    DOI
    Shuyang Li, Xingcun Li, Huibo Wu, Yunfan Wang, Shouqing Fu, Xin Liu, Wenhua Chen
    Tsinghua University · University of Michigan · Xidian University
  30. JSSC
    2025
    Broadband Harmonic-Assisted Power and Efficiency Enhancement in a 174–232-GHz SiGe Voltage-Controlled Oscillator
    DOI
    Hamidreza Aghasi, Xuyang Liu, Morteza Tavakolli Taba, Amirata Tabatabavakili, Ehsan Afshari
    University of California, Irvine · University of Michigan
  31. JSSC
    2025
    DAP: A 507-GMACs/J 256-Core Domain Adaptive Processor for Wireless Communication and Linear Algebra Kernels in 12-nm FINFET
    DOI
    Kuan-Yu Chen, Chi-Sheng Yang, Yu-Hsiu Sun, Chien-Wei Tseng, Morteza Fayazi, Xin He, Siying Feng, Yufan Yue, Trevor Mudge, Ronald Dreslinski, Hun-Seok Kim, David Blaauw
    University of Michigan
  32. JSSC
    2025
    Daedalus: A Physics-Inspired Mixed-Signal Optimization Engine With Dynamic Continuous-Time Injection for Solving 3-SAT Problems
    DOI
    Evangelos Dikopoulos, Ying-Tuan Hsu, Luke Wormald, Wei Tang, Benjamin Datsko, Zhengya Zhang, Michael P. Flynn
    University of Michigan
  33. JSSC
    2025
    RXO-LDPC: A Physics-Inspired Relaxation Oscillator-Based Solver Leveraging Six-Body Spin Interactions for Soft Decoding of LDPC Codes
    DOI
    Evangelos Dikopoulos, Luke Wormald, Ying-Tuan Hsu, Wei Tang, Po-Shao Chen, Zhengya Zhang, Michael P. Flynn
    University of Michigan
  34. VLSI
    2025
    128-Channel Multi-Chip Acoustic Hologram Generator
    DOI
    John Kustin, Taewook Kang, Seungheun Song, Yahya Naveed, Michael P. Flynn
    University of Michigan · Sungkyunkwan University
  35. VLSI
    2025
    A 0.71nJ, 1.53GS/s Throughput 256-FFT Using Floating Point Analog Computation
    DOI
    Jeongtaek Chang, Jungho Lee, Yi Shen, Sangbu Yun, Qirui Zhang, Dennis Sylvester, Hun-Seok Kim, David Blaauw
    University of Michigan
  36. VLSI
    2025
    A 22nm 25.08TOPS/W Multi-Task Transformer Accelerator with Mixed Precision Structured Sparsity and Two-Stage Task-Adaptive Power Management
    DOI
    Zichen Fan, Qirui Zhang, Pierre Abillama, Sara Shoori, Jungho Lee, Chien-Wei Tseng, Wei Meng, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan
  37. VLSI
    2025
    A 6.2mm2 56.6Gbps 18.2pJ/b oFEC Decoder for Optical Communications
    DOI
    Cheng-Hsun Lu, Wei Tang, Zhengya Zhang
    University of Michigan
  38. VLSI
    2025
    A Calibration-Free 175MHz Bandwidth 60dB SNDR 6th-Order Bandpass Cascaded Time-Interleaved Noise-Shaping SAR ADC with Optimum Zero Placement
    DOI
    Zhiyuan Zhao, Hsiang-Wen Chen, Seungheun Song, Taewook Kang, Michael Flynn
    University of Michigan · Sungkyunkwan University
  39. VLSI
    2025
    An NS-SAR Quantizer-Based Pipeline Incremental Delta-Sigma ADC Using a Current-Regulated Floating Ring Amplifier and Two-Phase Miller Negative-C
    DOI
    Seungheun Song, Taewook Kang, Alexander Knowlton, Seungjong Lee, Michael P. Flynn
    University of Michigan · Sungkyunkwan University
  40. VLSI
    2025
    An OFDMA Baseband Processor Enabling $165\mu \mathrm{W}$ Long-Range IoT Localization
    DOI
    Andrea Bejarano-Carbó, Chien-Wei Tseng, Demba Komma, Pierre Abillama, Zichen Fan, Dennis Sylvester, Hun-Seok Kim, David Blaauw
    University of Michigan
  41. VLSI
    2025
    EVA: A 16mm2 1.54TFLOPS Tiled-Based Accelerator for Evolvable Edge Computing
    DOI
    Junkang Zhu, Minsik Kim, Cheng-Hsun Lu, Wei Tang, Tianyu Wei, Zhengya Zhang
    University of Michigan
  42. ESSERC
    2024
    A 22nm 9.51 TOPS/W Neural Engine with 2MB MRAM Leveraging Sparse-Orthogonal Walsh-Hadamard Transform Computations and Dynamic Power Gating
    DOI
    Pierre Abillama, Qirui Zhang, Zichen Fan, Hyochan An, Kuan-Yu Chen, Yu Chen, David Blaauw, Dennis Sylvester, Hun-Seok Kim
    University of Michigan
  43. ESSERC
    2024
    A 4.3 GHz Digital-Sampling PLL with Noise-Shaping SAR ADC Phase Detector
    DOI
    Matthew R. Belz, Zhengqi Xu, Hsiang-Wen Chen, Seungheun Song, Michael P. Flynn
    University of Michigan
  44. ESSERC
    2024
    A Relaxation Oscillator-Based Probabilistic Combinatorial Optimization Engine for Soft Decoding of LDPC Codes
    DOI
    Evangelos Dikopoulos, Luke Wormald, Ying-Tuan Hsu, Wei Tang, Po-Shao Chen, Zhengya Zhang, Michael P. Flynn
    University of Michigan
  45. ISSCC
    2024
    2.8 A 21.9ns 15.7 Gbps/mm² (128,15) BOSS FEC Decoder for 5G/6G URLLC Applications
    DOI
    Dongyun Kam, Sangbu Yun, Jeongwon Choe, Zhengya Zhang, Namyoon Lee, Youngjoo Lee
    Pohang University of Science and Technology · University of Michigan · Korea University
  46. ISSCC
    2024
    24.4 Sub-THz Ruler: Spectral Bistability in a 235GHz Self-Injection-Locked Oscillator for Agile and Unambiguous Ranging
    DOI
    S. M. Hossein Naghavi, Morteza Tavakoli Taba, Amirata Tabatabavakili, Ali Mostajeran, Mohammed Aseeri, Andreia Cathelin, Ehsan Afshari
    University of Washington · University of Michigan · Apple · King Abdulaziz City for Science and Technology · STMicroelectronics
  47. JSSC
    2024
    A 1.5-μW Fully-Integrated Keyword Spotting SoC in 28-nm CMOS With Skip-RNN and Fast-Settling Analog Frontend for Adaptive Frame Skipping
    DOI
    Heejin Yang, Ji-Hwan Seol, Rohit Rothe, Zichen Fan, Qirui Zhang, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan · Samsung
  48. JSSC
    2024
    A 28.8-mW Accelerator IC for Dark Channel Prior-Based Blind Image Deblurring
    DOI
    Po-Shao Chen, Yen-Lung Chen, Yu-Chi Lee, Zih-Sing Fu, Chia-Hsiang Yang
    National Taiwan University · University of Michigan · Massachusetts Institute of Technology
  49. JSSC
    2024
    A Fast Back-to-Lock DPLL-Based 192–210-GHz Chirp Generator With +5.9-dBm Peak Output Power for Sub-THz Imaging and Sensing
    DOI
    Lili Chen, Morteza Tavakoli Taba, Zainulabideen Khalifa, Andreia Cathelin, Ehsan Afshari
    University of Michigan · King Fahd University of Petroleum and Minerals · STMicroelectronics
  50. JSSC
    2024
    A High-Efficiency High-Power 170-176-GHz Frequency Stabilized Quadrature Radiator
    DOI
    Lili Chen, Andreia Cathelin, Ehsan Afshari
    University of Michigan · STMicroelectronics
  51. JSSC
    2024
    A Multimode 157 μW 4-Channel 80 dBA-SNDR Speech Recognition Frontend With Direction-of-Arrival Correction Adaptive Beamformer
    DOI
    Taewook Kang, Seungjong Lee, Seungheun Song, Mohammad Reza Haghighat, Michael P. Flynn
    University of Michigan · Apple · Qualcomm · Intel
  52. JSSC
    2024
    A Sub-mm3 Wireless Neural Stimulator IC for Visual Cortical Prosthesis With Optical Power Harvesting and 7.5-kb/s Data Telemetry
    DOI
    Jungho Lee, Joseph G. Letner, Jongyup Lim, Gabriele Atzeni, Jiawei Liao, Abhilasha Kamboj, Bhavika Mani, Seokhyeon Jeong, Yejoong Kim, Yi Sun, Beomseo Koo, Julianna Richie, Elena della Valle, Paras R. Patel, Dennis Sylvester, Hun-Seok Kim, Taekwang Jang, Jamie D. Phillips, Cynthia A. Chestek, James Weiland, David Blaauw
    University of Michigan · ETH Zurich · University of Delaware
  53. JSSC
    2024
    AIMMI: Audio and Image Multi-Modal Intelligence via a Low-Power SoC With 2-MByte On-Chip MRAM for IoT Devices
    DOI
    Zichen Fan, Qirui Zhang, Hyochan An, Boxun Xu, Li Xu, Chien-Wei Tseng, Yimai Peng, Andrea Bejarano-Carbo, Pierre Abillama, Ang Cao, Bowen Liu, Changwoo Lee, Zhehong Wang, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan · Apple · University of California, Santa Barbara · NVIDIA · Meta
  54. JSSC
    2024
    An Anti-Aliasing-Filter-Assisted 3rd-Order VCO-Based CTDSM With NS-SAR Quantizer
    DOI
    Hsiang-Wen Chen, Seungjong Lee, Michael P. Flynn
    University of Michigan · Qualcomm
  55. JSSC
    2024
    An Interference-Resilient Bit-Level Duty-Cycled ULP Receiver Leveraging a Dual-Chirp Modulation
    DOI
    Milad Moosavifar, Jaeho Im, David D. Wentzloff
    University of Michigan
  56. JSSC
    2024
    An Ultralow-Power Triaxial MEMS Accelerometer With High-Voltage Biasing and Electrostatic Mismatch Compensation
    DOI
    Yimai Peng, Seokhyeon Jeong, Kyojin Choo, Yejoong Kim, Li-Yu Chen, Rohit Rothe, Li Xu, Ilya Gurin, Omid Oliaei, Matthew J. Thompson, Stephen Bart, Peter Hartwell, David Blaauw, Dennis Sylvester
    University of Michigan · École Polytechnique Fédérale de Lausanne · NVIDIA
  57. JSSC
    2024
    Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration
    DOI
    Wei Tang, Sung-Gun Cho, Tim Tri Hoang, Jacob Botimer, Wei Qiang Zhu, Ching-Chi Chang, Cheng-Hsun Lu, Junkang Zhu, Yaoyu Tao, Tianyu Wei, Naomi Kavi Motwani, Mani Yalamanchi, Ramya Yarlagadda, Sirisha Rani Kale, Mark Flanigan, Allen Chan, Thungoc Tran, Sergey Shumarayev, Zhengya Zhang
    University of Michigan · Intel
  58. JSSC
    2024
    Parallel Versus Serial: Design of an Optical Receiver With Integrated Blue Photodetectors and Digitally Tunable Low-End Cutoff Frequency for MicroLED-Based Parallel Interchip Communication
    DOI
    Farzad Khoeini, Bardia Pezeshki, Emad Afifi, Alex Tselikov, Robert F. Kalman, Bahareh Hadidian, Ehsan Afshari
    University of Michigan
  59. JSSC
    2024
    RoboVisio: A Micro-Robot Vision Domain-Specific SoC for Autonomous Navigation Enabling Fully-on-Chip Intelligence via 2-MB eMRAM
    DOI
    Qirui Zhang, Zichen Fan, Hyochan An, Zhehong Wang, Ziyun Li, Guanru Wang, Pierre Abillama, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan · Apple · Meta · Cisco Systems (United States)
  60. VLSI
    2024
    A 79.2dB-SNDR Slope-Adaptive Dynamic Zoom-and-Track Incremental $\Delta\Sigma$ Neural Recording Frontend with Resolution-Preservative 192mV/ms Transient Tracking
    DOI
    Sungjin Oh, Hyunsoo Song, Jose R. L. Ruiz, Wangbo Chen, Sung-Yun Park, Michael P. Flynn, Euisik Yoon
    University of Michigan
  61. VLSI
    2024
    A uW Output Power, >100V, Single-Capacitor Switched DC-DC Up/Down Converter
    DOI
    Rohit Rothe, Jungho Lee, Zichen Fan, Li-Yu Chen, Donguk Seo, Yoonmyung Lee, Dennis Sylvester, David Blaauw
    University of Michigan · Sungkyunkwan University
  62. VLSI
    2024
    An 11.4mm2 40.2Gbps 17.4pJ/b/Iteration Soft-Decision Open Forward Error Correction Decoder for Optical Communications
    DOI
    Cheng-Hsun Lu, Wei Tang, Jiyoon Han, Zhengya Zhang
    University of Michigan
  63. A-SSCC
    2023
    A 0.000261 mm2 Single-Channel 1 GS/s 8-Bit 3-Stage Capacitor Array-Assisted Charge-Injection DAC-Based SAR ADC in 28 nm CMOS
    DOI
    Chan-Ho Kye, Kyojin Choo
    University of Michigan · École Polytechnique Fédérale de Lausanne
  64. CICC
    2023
    A 194-238GHz Fully On-Chip Self-Referenced Frequency Stabilized Radiator for High Range Resolution Imaging
    DOI
    Bahareh Hadidian, Farzad Khoeini, S. M. Hossein Naghavi, Andreia Cathelin, Kamal Sarabandi, Ehsan Afshari
    University of Michigan · STMicroelectronics
  65. CICC
    2023
    A Compact CMOS 363 GHz Autodyne FMCW Radar with 57 GHz Bandwidth for Dental Imaging
    DOI
    Morteza Tavakoli Taba, S. M. Hossein Naghavi, Morteza Fayazi, Ali Sadeghi, Andreia Cathelin, Ehsan Afshari
    University of Michigan · University of Washington · STMicroelectronics
  66. CICC
    2023
    A Low-Power 20Gb/s 196GHz BPSK Wireless Transmitter with Energy Efficiency FoM of 0.15pJ/bit/cm
    DOI
    Lili Chen, Morteza Taba, Andreia Cathelin, Ehsan Afshari
    University of Michigan · STMicroelectronics
  67. ESSERC
    2023
    A 4.6nW Subthreshold Voltage Reference with 400× Current Variation Reduction and 64-Step 0.11% Output Voltage Programmability
    DOI
    Yimai Peng, Ashwin Bhat, Sanjay Wadhwa, David Blaauw, Dennis Sylvester
    University of Michigan · NXP
  68. ESSERC
    2023
    A 53-62 GHz Two-channel Differential 6-bit Active Phase Shifter in 55-nm SiGe Technology
    DOI
    Morteza Tavakoli Taba, S. M. Hossein Naghavi, Sara Shoouri, Andreia Cathelin, Ehsan Afshari
    University of Michigan · STMicroelectronics
  69. ISSCC
    2023
    29.3 An 8.09TOPS/W Neural Engine Leveraging Bit-Sparsified Sign-Magnitude Multiplications and Dual Adder Trees
    DOI
    Hyochan An, Yu Chen, Zichen Fan, Qirui Zhang, Pierre Abillama, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan
  70. ISSCC
    2023
    A $1.5\mu\mathrm{W}$ End-to-End Keyword Spotting SoC with Content-Adaptive Frame Sub-Sampling and Fast-Settling Analog Frontend
    DOI
    Ji-Hwan SeoI, Heejin Yang, Rohit Rothe, Zichen Fan, Qirui Zhang, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan · Samsung
  71. JSSC
    2023
    A High-Voltage Generator and Multiplexer for Electrostatic Actuation in Programmable Matter
    DOI
    Yimai Peng, Gordy Carichner, Yejoong Kim, Li-Yu Chen, Rémy Tribhout, Benoît Piranda, Julien Bourgeois, David Blaauw, Dennis Sylvester
    University of Michigan · Franche-Comté Électronique Mécanique Thermique et Optique - Sciences et Technologies · Université de Franche-Comté
  72. JSSC
    2023
    An 81.6 dB SNDR 15.625 MHz BW Third-Order CT SDM With a True Time-Interleaving Noise-Shaping Quantizer
    DOI
    Seungjong Lee, Taewook Kang, Seungheun Song, Kyumin Kwon, Michael P. Flynn
    University of Michigan · Qualcomm · Apple
  73. JSSC
    2023
    An RC Delay-Based Pressure-Sensing System With Energy-Efficient Bit-Level Oversampling Techniques for Implantable IOP Monitoring Systems
    DOI
    Donguk Seo, Minsik Cho, Minhyeok Jeong, Gicheol Shin, Inhee Lee, David Blaauw, Yoonmyung Lee
    Sungkyunkwan University · Samsung · University of Pittsburgh · University of Michigan
  74. JSSC
    2023
    PLL Fractional Spur’s Impact on FSK Spectrum and a Synthesizable ADPLL for a Bluetooth Transmitter
    DOI
    Kyumin Kwon, Omar A. B. Abdelatty, David D. Wentzloff
    University of Michigan
  75. VLSI
    2023
    A 0.024mm² 84.2dB-SNDR 1MHz-BW 3 rd -Order VCO-Based CTDSM with NS-SAR Quantizer (NSQ VCO CTDSM)
    DOI
    Hsiang-Wen Chen, Seungjong Lee, Michael Flynn
    University of Michigan · Qualcomm
  76. VLSI
    2023
    A 150-MS/s Fully Dynamic SAR-Assisted Pipeline ADC Using a Floating Ring Amplifier and Gain-Enhancing Miller Negative-C
    DOI
    Seungheun Song, Taewook Kang, Seungjong Lee, Michael P. Flynn
    University of Michigan · Apple · Qualcomm
  77. VLSI
    2023
    A Reconfigurable Analog FIR Filter Achieving −70dB Rejection with Sharp Transition for Narrowband Receivers
    DOI
    Chien-Wei Tseng, Zhen Feng, Zichen Fan, Hyochan An, Yunfan Wang, Hun-Seok Kim, David Blaauw
    University of Michigan
  78. VLSI
    2023
    A Wireless Neural Stimulator IC for Cortical Visual Prosthesis
    DOI
    Jungho Lee, Joseph Letner, Jongyup Lim, Yi Sun, Seokhyeon Jeong, Yejoong Kim, Beomseo Koo, Gabriele Atzeni, Jiawei Liao, Julianna Richie, Elena Della Valle, Paras Patel, Taekwang Jang, Cynthia Chestek, Jamie Phillips, James Weiland, Dennis Sylvester, Hun-Seok Kim, David Blaauw
    University of Michigan · ETH Zurich · University of Delaware
  79. VLSI
    2023
    Arvon: A Heterogeneous SiP Integrating a 14nm FPGA and Two 22nm 1.8TFLOPS/W DSPs with 1.7Tbps/mm2 AIB 2.0 Interface to Provide Versatile Workload Acceleration
    DOI
    Wei Tang, Sung-Gun Cho, Tim Tri Hoang, Jacob Botimer, Wei Qiang Zhu, Ching-Chi Chang, Cheng-Hsun Lu, Junkang Zhu, Yaoyu Tao, Tianyu Wei, Naomi Kavi Motwani, Mani Yalamanchi, Ramya Yarlagadda, Sirisha Kale, Mark Flanigan, Allen Chan, Thungoc Tran, Sergey Shumarayev, Zhengya Zhang
    University of Michigan · Intel
  80. ESSERC
    2022
    6GS/s 8-channel CIC SAR TI-ADC with Neural Network Calibration
    DOI
    Evelyn Ware, Justin Correll, Seungjong Lee, Michael Flynn
    University of Michigan
  81. ESSERC
    2022
    A Review on the State-of-the-Art THz FMCW Radars Implemented on Silicon: Invited
    DOI
    Morteza Tavakoli Taba, S. M. Hossein Naghavi, Ehsan Afshari
    University of Michigan
  82. ESSERC
    2022
    Reconfigurable Intelligent Surfaces Enabled by Silicon Chips for Secure and Robust mmWave and THz Wireless Communication
    DOI
    Kaushik Sengupta, Suresh Venkatesh, Hooman Saeidi, Xuyang Lu
    Princeton University · University of Michigan
  83. ISSCC
    2022
    A $110\mu \mathrm{W}$ 2.5kb/s −103dBm-Sensitivity Dual-Chirp Modulated ULP Receiver Achieving −41dB SIR
    DOI
    Milad Moosavifar, Jaeho Im, Trevor Odelberg, David Wentzloff
    University of Michigan
  84. ISSCC
    2022
    A $\boldsymbol{210}\times \boldsymbol{340}\times \boldsymbol{50}\boldsymbol{\mu}\mathbf{m}$ Integrated CMOS System f0 $\mathbf{r}$ Micro-Robots with Energy Harvesting, Sensing, Processing, Communication and Actuation
    DOI
    Li Xu, Maya Lassiter, Xiao Wu, Yejoong Kim, Jungho Lee, Makoto Yasuda, Masaru Kawaminami, Marc Miskin, David Blaauw, Dennis Sylvester
    University of Michigan · ユナイテッド・セミコンダクター・ジャパンUnited Semiconductor Japan · University of Pennsylvania
  85. ISSCC
    2022
    A Long-Range Narrowband RF Localization System with a Crystal-Less Frequency-Hopping Receiver
    DOI
    Chien-Wei Tseng, Demba Komma, Kuan-Yu Chen, Rohit Rothe, Zhen Feng, Makoto Yasuda, Masaru Kawaminami, Hun-Seok Kim, David Blaauw
    University of Michigan · ユナイテッド・セミコンダクター・ジャパンUnited Semiconductor Japan
  86. ISSCC
    2022
    A Multimode 157μW 4-Channel 80dBA-SNDR Speech-Recognition Frontend With Self-DOA Correction Adaptive Beamformer
    DOI
    Taewook Kang, Seungjong Lee, Seungheun Song, Mohammad R. Haghighat, Michael P. Flynn
    University of Michigan · Intel
  87. JSSC
    2022
    A 220-GHz Energy-Efficient High-Data-Rate Wireless ASK Transmitter Array
    DOI
    Bahareh Hadidian, Farzad Khoeini, S. M. Hossein Naghavi, Andreia Cathelin, Ehsan Afshari
    University of Michigan · STMicroelectronics
  88. JSSC
    2022
    A 43 nW, 32 kHz, ±4.2 ppm Piecewise Linear Temperature-Compensated Crystal Oscillator With ΔΣ-Modulated Load Capacitance
    DOI
    Sujin Park, Ji-Hwan Seol, Li Xu, Seonghwan Cho, Dennis Sylvester, David Blaauw
    Korea Advanced Institute of Science and Technology · University of Michigan
  89. JSSC
    2022
    A 510-pW 32-kHz Crystal Oscillator With High Energy-to-Noise-Ratio Pulse Injection
    DOI
    Li Xu, Taekwang Jang, Jongyup Lim, Kyojin David Choo, David Blaauw, Dennis Sylvester
    University of Michigan · ETH Zurich
  90. JSSC
    2022
    A Delta Sigma-Modulated Sample and Average Common-Mode Feedback Technique for Capacitively Coupled Amplifiers in a 192-nW Acoustic Analog Front-End
    DOI
    Rohit Rothe, Minchang Cho, Kyojin Choo, Seokhyeon Jeong, Sechang Oh, Jungho Lee, Dennis Sylvester, David Blaauw
    University of Michigan · Apple · École Polytechnique Fédérale de Lausanne
  91. JSSC
    2022
    A Light-Tolerant Wireless Neural Recording IC for Motor Prediction With Near-Infrared-Based Power and Data Telemetry
    DOI
    Jongyup Lim, Jungho Lee, Eunseong Moon, Michael Barrow, Gabriele Atzeni, Joseph G. Letner, Joseph T. Costello, Samuel R. Nason, Paras R. Patel, Yi Sun, Parag G. Patil, Hun-Seok Kim, Cynthia A. Chestek, Jamie Phillips, David Blaauw, Dennis Sylvester, Taekwang Jang
    University of Michigan · ETH Zurich · Michigan Medicine · University of Delaware
  92. JSSC
    2022
    An Eight-Element Frequency-Selective Acoustic Beamformer and Bitstream Feature Extractor
    DOI
    Seungjong Lee, Taewook Kang, John Bell, Mohammad Haghighat, Alberto Martinez, Michael P. Flynn
    University of Michigan · Qualcomm · Intel · Microsoft
  93. JSSC
    2022
    VOTA: A Heterogeneous Multicore Visual Object Tracking Accelerator Using Correlation Filters
    DOI
    Junkang Zhu, Wei Tang, Ching-En Lee, Haolei Ye, Eric McCreath, Zhengya Zhang
    University of Michigan · Australian National University
  94. JSSC
    2022
    Versa: A 36-Core Systolic Multiprocessor With Dynamically Reconfigurable Interconnect and Memory
    DOI
    Sung Kim, Morteza Fayazi, Alhad Daftardar, Kuan-Yu Chen, Jielun Tan, Subhankar Pal, Tutu Ajayi, Yan Xiong, Trevor Mudge, Chaitali Chakrabarti, David Blaauw, Ronald Dreslinski, Hun-Seok Kim
    University of Michigan · Qualcomm · Arizona State University
  95. VLSI
    2022
    A 184nW, 121µg/√Hz Noise Floor Triaxial MEMS Accelerometer with Integrated CMOS Readout Circuit and Variation-Compensated High Voltage MEMS Biasing
    DOI
    Yimai Peng, Seokhyeon Jeong, Kyojin Choo, Yejoong Kim, Li-Yu Chen, Rohit Rothe, Li Xu, Ilya Gurin, Omid Oliaei, Vadim Tsinker, Stephen Bart, Peter Hartwell, David Blaauw, Dennis Sylvester
    University of Michigan
  96. VLSI
    2022
    A 22nm 3.5TOPS/W Flexible Micro-Robotic Vision SoC with 2MB eMRAM for Fully-on-Chip Intelligence
    DOI
    Qirui Zhang, Hyochan An, Zichen Fan, Zhehong Wang, Ziyun Li, Guanru Wang, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan
  97. VLSI
    2022
    A 260×274 μm2 572 nW Neural Recording Micromote Using Near-Infrared Power Transfer and an RF Data Uplink
    DOI
    Gabriele Atzeni, Jongyup Lim, Jiawei Liao, Alessandro Novello, Jungho Lee, Eunseong Moon, Michael Barrow, Joseph Letner, Joseph Costello, Samuel R. Nason, Paras R. Patel, Parag G. Patil, Hun-Seok Kim, Cynthia A. Chestek, Jamie Phillips, David Blaauw, Taekwang Jang
    ETH Zurich · University of Michigan · University of Delaware
  98. VLSI
    2022
    A 286nW, 103V High Voltage Generator and Multiplexer for Electrostatic Actuation in Programmable Matter
    DOI
    Yimai Peng, Gordy Carichner, Yejoong Kim, Li-Yu Chen, Remy Tribhout, Benoit Piranda, Julien Bourgeois, David Blaauw, Dennis Sylvester
    University of Michigan · Franche-Comté Électronique Mécanique Thermique et Optique - Sciences et Technologies
  99. VLSI
    2022
    A 507 GMACs/J 256-Core Domain Adaptive Systolic-Array-Processor for Wireless Communication and Linear-Algebra Kernels in 12nm FINFET
    DOI
    Kuan-Yu Chen, Chi-Sheng Yang, Yu-Hsiu Sun, Chien-Wei Tseng, Morteza Fayazi, Xin He, Siying Feng, Yufan Yue, Trevor Mudge, Ronald Dreslinski, Hun-Seok Kim, David Blaauw
    University of Michigan
  100. VLSI
    2022
    An 8-bit 20.7 TOPS/W Multi-Level Cell ReRAM-based Compute Engine
    DOI
    Justin M. Correll, Lu Jie, Seungheun Song, Seungjong Lee, Junkang Zhu, Wei Tang, Luke Wormald, Jack Erhardt, Nicolas Breil, Roger Quon, Deepak Kamalanathan, Siddarth Krishnan, Michael Chudzik, Zhengya Zhang, Wei D. Lu, Michael P. Flynn
    University of Michigan · Applied Materials (United States)
  101. VLSI
    2022
    An 81.6dB SNDR 15.625MHz BW 3rd Order CT SDM with a True TI NS Quantizer
    DOI
    Seungjong Lee, Taewook Kang, Seungheun Song, Kyumin Kwon, Michael Flynn
    University of Michigan
  102. VLSI
    2022
    Audio and Image Cross-Modal Intelligence via a 10TOPS/W 22nm SoC with Back-Propagation and Dynamic Power Gating
    DOI
    Zichen Fan, Hyochan An, Qirui Zhang, Boxun Xu, Li Xu, Chien-Wei Tseng, Yimai Peng, Ang Cao, Bowen Liu, Changwoo Lee, Zhehong Wang, Fanghao Liu, Guanru Wang, Shenghao Jiang, Hun-Seok Kim, David Blaauw, Dennis Sylvester
    University of Michigan
  103. VLSI
    2022
    NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging
    DOI
    Teyuh Chou, Wei Tang, Mihai D. Rotaru, Chester Liu, Rahul Dutta, Sharon Lim Pei Siang, David Ho Soon Wee, Surya Bhattacharya, Zhengya Zhang
    University of Michigan · Agency for Science, Technology and Research · Institute of Microelectronics