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VLSI · 2022–2026 LIVE

ETH Zurich

対象論文Papers 21 · 筆頭著者first author 17 · 著者按分fractional 14.80 · 世界World #7

所属著者Affiliated authors

ORCID が一致する著者は同一人物としてまとめています。それ以外は表記ごとに別人として扱います。Authors sharing an ORCID are merged; other spellings are listed separately.

順位Rank著者Author論文数Papers
1Taekwang Jang ORCID12
2Gabriele Atzeni ORCID6
2Jiawei Liao ORCID6
4Rosario Incandela4
4Sina Arjmandpour ORCID4
6Alessandro Novello ORCID3
6Can Livanelioglu ORCID3
6Woojun Choi ORCID3
9Adam Wang2
9Christoph Studer2
9Donghwan Kim2
9Dongwon Lee ORCID2
9Fuze Jiang2
9Giorgio Cristiano2
9Hangxing Liu ORCID2
9Hesam Ghiasi2
9Hua Wang ORCID2
9Jing Wang ORCID2
9Marco Saif ORCID2
9Oscar Castañeda2
9Thomas Burger ORCID2
9Tim Keller2
9Ying Kong2
9Yiyang Chen2
9Zhikai Huang ORCID2
26A. Serdar Yonar1
26Abhishek Kumar1
26Florian Bucheli1
26Frank K. Gürkaynak ORCID1
26Gian Marti1
26Gianna Paulin ORCID1
26H. Long1
26Hesam Omdeh Ghiasi1
26Jiang Gong ORCID1
26Jonas Widmer1
26Kwantae Kim ORCID1
26Lavinia Recchioni ORCID1
26Long He1
26Luca Benini ORCID1
26Luca Bertaccini ORCID1
26Luca Colagrande ORCID1
26Manuel Eggimann ORCID1
26Mingxiang Gao ORCID1
26Mohsen Khodaee1
26Niels Kuster1
26Nils Wistoff ORCID1
26Parham Davami1
26Paul Scheffler ORCID1
26Pietro Velcich1
26Qiuting Huang1
26Sean Weaver1
26Seyed Hadi Mirfarshbafan1
26Suyang Song1
26Thomas Benz ORCID1
26Tilman Schlotter1
26Tim Fischer ORCID1
26Tobias Goetschi1
26Xi Chen1
26Yichao Zhang ORCID1
26Youngwoo Ji ORCID1
26Yuguo Sheng1

対象論文Papers

  1. VLSI
    2026
    A 256-Channel, 32-Interconnect, 1.25-NEF, in Vitro and In Vivo Neural Interface With Auto-Calibrated Input Impedance Boosting and on-Chip Spike Detection for Flexible Capacitive Microelectrode Array
    DOI
    Yiyang Chen, Suhyeon Nam, Sun-woong Byun, Pietro Velcich, Shinil Cho, Chanwoo Lee, Ju Young Lee, Sean Weaver, Enrico Brugnolotto, Eunkyu Hwang, Dongseok Seo, Eunee Lee, Ki Jun Yu, Woojun Choi, Taekwang Jang
    ETH Zurich · Yonsei University · Institut Català de Nanociència i Nanotecnologia
  2. VLSI
    2026
    A 39pJ/b 7.3Gbps 1.3mm 2 Multi-Subcarrier Massive MU-MIMO-OFDM Detector Exploiting Beamspace Sparsity and Frequency-Domain Correlation in 22FDX
    DOI
    Abhishek Kumar, Seyed Hadi Mirfarshbafan, Oscar Castañeda, Christoph Studer
    ETH Zurich
  3. VLSI
    2026
    A 5.7-6.8GHz Capacitively-Coupled Series-Assisted Parallel-Resonance VCO Achieving −148.8 dBc/Hz PN, 193.5 FoM, and 202.0 FoM A at 10MHz Offset
    DOI
    Jiang Gong, Long He, Taekwang Jang
    ETH Zurich
  4. VLSI
    2026
    A 50-mm 2 Crystal-Free Bidirectional WPDT System with Carrier-Reuse Clocking for Implantable Neural Interfaces
    DOI
    Cong Ding, Mingxiang Gao, Shaokang Zhao, Niels Kuster, Armin Tajalli, Mahsa Shoaran
    École Polytechnique Fédérale de Lausanne · ETH Zurich
  5. VLSI
    2026
    Class-D LC Oscillator-Based Capacitively Isolated DC-DC Converters with False-Mode Prevention Technique Achieving 91.3% and 43.3% Peak-Efficiencies
    DOI
    Suyang Song, Taekwang Jang
    ETH Zurich
  6. VLSI
    2025
    A 33aFrms34pF Base Capacitance, 192fF Input Range 500kHz Sampling Frequencycapacitancetovoltage Converter using a Resonant LC Bridge
    DOI
    Hesam Omdeh Ghiasi, Sina Arjmandpour, Taekwang Jang
    ETH Zurich
  7. VLSI
    2024
    A 0.29pJ/Step Fully Discrete-Time Charge Domain Bridge-to-Digital Converter for Force Sensing in Spinal Implants Using RC Bridge
    DOI
    Tim Keller, Rosario Incandela, Xi Chen, Hesam Ghiasi, Mohsen Khodaee, Sina Arjmandpour, Jiawei Liao, H. Long, Tobias Goetschi, Jonas Widmer, Taekwang Jang
    ETH Zurich
  8. VLSI
    2024
    A Jammer-Mitigating 267 Mb/s 3.78mm2 583 mW $\mathbf{32}\times \mathbf{8}$ Multi-User MIMO Receiver in 22FDX
    DOI
    Florian Bucheli, Oscar Castañeda, Gian Marti, Christoph Studer
    ETH Zurich
  9. VLSI
    2024
    A Subcellular-Resolution Multimodal CMOS Biosensor Array with 16K Ion-Selective Pixels for Real-Time Monitoring Potassium Dynamics
    DOI
    Hangxing Liu, Fuze Jiang, Ying Kong, Dongwon Lee, Yuguo Sheng, Adam Wang, Zhikai Huang, Marco Saif, Thomas Burger, Jing Wang, Hua Wang
    ETH Zurich
  10. VLSI
    2024
    Highly Sensitive Multimodal CMOS Antifouling Sensor Array with Multi-Use Electrodes for Single-Cell-Level Profiling of Biophysical and Biochemical Parameters
    DOI
    Hangxing Liu, Fuze Jiang, Adam Wang, Zhikai Huang, Ying Kong, Marco Saif, Dongwon Lee, Thomas Burger, Jing Wang, Hua Wang
    ETH Zurich
  11. VLSI
    2024
    Occamy: A 432-Core 28.1 DP-GFLOP/s/W 83% FPU Utilization Dual-Chiplet, Dual-HBM2E RISC-V-Based Accelerator for Stencil and Sparse Linear Algebra Computations with 8-to-64-bit Floating-Point Support in 12nm FinFET
    DOI
    Gianna Paulin, Paul Scheffler, Thomas Benz, Matheus Cavalcante, Tim Fischer, Manuel Eggimann, Yichao Zhang, Nils Wistoff, Luca Bertaccini, Luca Colagrande, Gianmarco Ottavi, Frank K. Gürkaynak, Davide Rossi, Luca Benini
    ETH Zurich · Stanford University · University of Bologna
  12. VLSI
    2023
    A 1,024-Channel, 64-Interconnect, Capacitive Neural Interface Using a Cross-Coupled Microelectrode Array and 2-Dimensional Code-Division Multiplexing
    DOI
    Woojun Choi, Yiyang Chen, Donghwan Kim, Sean Weaver, Tilman Schlotter, Can Livanelioglu, Jiawei Liao, Rosario Incandela, Parham Davami, Gabriele Atzeni, Sina Arjmandpour, Seong-Hwan Cho, Taekwang Jang
    ETH Zurich · Korea Advanced Institute of Science and Technology
  13. VLSI
    2023
    A 4.1W/mm² Peak Power Density and 77% Peak Efficiency Fully Integrated DC-DC Converter based on Electromagnetically Coupled Class-D LC Oscillators and a Resonant LC Flying Impedance in 22nm FDSOI CMOS
    DOI
    Alessandro Novello, Gabriele Atzeni, Tim Keller, Taekwang Jang
    ETH Zurich
  14. VLSI
    2023
    A Highly-Digital PWM-Based Impedance Monitoring IC with 143.2dB DR and 17.7fFrms Resolution
    DOI
    Hyeonho Han, Woojun Choi, Jaehyun Kim, Jaesuk Sung, Heon-Jin Choi, Youngcheol Chae
    Yonsei University · ETH Zurich
  15. VLSI
    2023
    A Wireless Neural Stimulator IC for Cortical Visual Prosthesis
    DOI
    Jungho Lee, Joseph Letner, Jongyup Lim, Yi Sun, Seokhyeon Jeong, Yejoong Kim, Beomseo Koo, Gabriele Atzeni, Jiawei Liao, Julianna Richie, Elena Della Valle, Paras Patel, Taekwang Jang, Cynthia Chestek, Jamie Phillips, James Weiland, Dennis Sylvester, Hun-Seok Kim, David Blaauw
    University of Michigan · ETH Zurich · University of Delaware
  16. VLSI
    2023
    An Energy-Efficient Impedance-Boosted Discrete-Time Amplifier Achieving 0.34 Noise Efficiency Factor and 389 MΩ Input Impedance
    DOI
    Gabriele Atzeni, Can Livanelioglu, Lavinia Recchioni, Sina Arjmandpour, Taekwang Jang
    ETH Zurich
  17. VLSI
    2022
    A 0.0014 mm2, 1.18 TΩ Segmented Duty-Cycled Resistor Replacing Pseudo-Resistor for Neural Recording Interface Circuits
    DOI
    Can Livanelioglu, Woojun Choi, Donghwan Kim, Jiawei Liao, Rosario Incandela, Giorgio Cristiano, Taekwang Jang
    ETH Zurich · Korea Advanced Institute of Science and Technology
  18. VLSI
    2022
    A 260×274 μm2 572 nW Neural Recording Micromote Using Near-Infrared Power Transfer and an RF Data Uplink
    DOI
    Gabriele Atzeni, Jongyup Lim, Jiawei Liao, Alessandro Novello, Jungho Lee, Eunseong Moon, Michael Barrow, Joseph Letner, Joseph Costello, Samuel R. Nason, Paras R. Patel, Parag G. Patil, Hun-Seok Kim, Cynthia A. Chestek, Jamie Phillips, David Blaauw, Taekwang Jang
    ETH Zurich · University of Michigan · University of Delaware
  19. VLSI
    2022
    An 8-bit 56GS/s 64x Time-Interleaved ADC with Bootstrapped Sampler and Class-AB Buffer in 4nm CMOS
    DOI
    A. Serdar Yonar, Pier Andrea Francese, Matthias Brandli, Marcel Kossel, Thomas Morf, Jonathan E. Proesel, Sergey Rylov, Herschel Ainspan, Martin Cochet, Zeynep Deniz, Timothy Dickson, Troy Beukema, Christian Baks, Michael Beakes, John F. Bulzacchelli, Young-Ho Choi, Byoung-Joo Yoo, Hyoungbae Ahn, Dong-Hyuk Lim, Gunil Kang, Sang-Hune Park, Mounir Meghelli, Hyo-Gyuem Rhew, Daniel Friedman, Michael Choi, Mehmet Soyuer, Jongshin Shin
    ETH Zurich · IBM · IBM · Samsung
  20. VLSI
    2022
    An Impedance-boosted Switched-capacitor Low-noise Amplifier Achieving 0.4 NEF
    DOI
    Gabriele Atzeni, Rosario Incandela, Youngwoo Ji, Alessandro Novello, Hesam Ghiasi, Giorgio Cristiano, Jiawei Liao, Qiuting Huang, Taekwang Jang
    ETH Zurich
  21. VLSI
    2022
    Neuro-CIM: A 310.4 TOPS/W Neuromorphic Computing-in-Memory Processor with Low WL/BL activity and Digital-Analog Mixed-mode Neuron Firing
    DOI
    Sangyeob Kim, Sangjin Kim, Soyeon Um, Soyeon Kim, Kwantae Kim, Hoi-Jun Yoo
    Korea Advanced Institute of Science and Technology · University of Zurich · ETH Zurich · Institute of Neuroinformatics