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企業・研究機関Company / Institute · ドイツGermany · 2022–2026 LIVE

Fraunhofer Research Institution for Microsystems and Solid State Technologies

世界World 28位 (0 pt) · 対象論文Papers 5

年別の推移Papers per year

会議・論文誌別の論文数（フルカウント）Papers per venue (full count)

0122022 ESSERC: 1120222023 ISSCC: 12023 ESSERC: 12202320242025 CICC: 12025 ESSERC: 1220252026
ISSCCCICCESSERC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC–1–––
CICC–––1–
ESSERC11–1–

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 1100.11世界World #77
VLSI Tier 1000.00–
JSSC Tier 1000.00–
CICC Tier 2111.00世界World #22
A-SSCC Tier 2000.00–
ESSERC Tier 2321.32世界World #22

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. CICC
    2025
    A 0.6V Supply Ultra-Compact Voltage Reference Exploiting MOS Threshold Correlations
    DOI
    Matthias Eberlein, Sebastian Ruping
    Fraunhofer Research Institution for Microsystems and Solid State Technologies
  2. ESSERC
    2025
    SENNA: An Ultra-Low Latency, Time-Deterministic Field-Programmable-Spiking-Neuron-Array (FPSNA)
    DOI
    Ferdinand Pscheidl, Elmar Herzer, Andreas Stoll, Leonidas Richter, Claudia Schuhmann, Stefan Köhler, Sebastian Ruping, Matthias Kampa, Ralf Brederlow, Johannes Leugering
    Fraunhofer Research Institution for Microsystems and Solid State Technologies · Fraunhofer Institute for Integrated Circuits · ZHAW Zurich University of Applied Sciences · Technical University of Munich · University of California San Diego
  3. ESSERC
    2023
    A FeFET In-Memory-Computing Core with Offset Cancellation for Mitigating Computational Errors
    DOI
    Lei Zhang, Pengcheng Xu, David Borggreve, Frank Vanselow, Ralf Brederlow
    Fraunhofer Research Institution for Microsystems and Solid State Technologies · Technical University of Munich
  4. ISSCC
    2023
    1.3 EU Ships Act Drives Pan-European Full-Stack Innovation Partnerships
    DOI
    Jo De Boeck, Jean-René Lèquepeys, Christoph Kutter
    IMEC · KU Leuven · Commissariat à l'Énergie Atomique et aux Énergies Alternatives · CEA Grenoble · Laboratoire d'Électronique des Technologies de l'Information · Universität der Bundeswehr München · Fraunhofer Research Institution for Microsystems and Solid State Technologies · Bundeswehr
  5. ESSERC
    2022
    Thermal switching of $\text{TiO}_{2}$ -based RRAM for parameter extraction and neuromorphic engineering
    DOI
    Alessandro Milozzi, Daniel Reiser, Andreas Drost, Thomas Neuner, Marc Tornow, Daniele Ielmini
    Politecnico di Milano · Fraunhofer Research Institution for Microsystems and Solid State Technologies · Technical University of Munich