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企業・研究機関Company / Institute · ドイツGermany · 2022–2026 LIVE

Infineon

世界World 28位 (0 pt) · 対象論文Papers 15

年別の推移Papers per year

会議・論文誌別の論文数（フルカウント）Papers per venue (full count)

012342022 ESSERC: 4420222023 JSSC: 12023 ESSERC: 1220232024 JSSC: 12024 ESSERC: 1220242025 ISSCC: 12025 VLSI: 12025 ESSERC: 1320252026 JSSC: 22026 CICC: 242026
ISSCCVLSIJSSCCICCESSERC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC–––1–
VLSI–––1–
JSSC–11–2
CICC––––2
ESSERC4111–

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 1111.00世界World #77
VLSI Tier 1110.75世界World #48
JSSC Tier 1400.95世界World #43
CICC Tier 2211.31世界World #13
A-SSCC Tier 2000.00–
ESSERC Tier 2743.65世界World #11

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. CICC
    2026
    A 26-Channel Fully-Integrated SoC with Autonomous In-Situ Reconfiguration for Trapped-Ion Shuttling in 130nm BCD
    DOI
    A. Meyer, M. Neumann, Z. Guo, P. J. Ritter, M. Badawy, M. Hartmann, M. Abu Zahra, M. Ebner, H. Thabet, S. Fischer, M. Sieberer, J. Repp, M. Schilling, B. Hampel, M. Brandl, V. Issakov
    Technische Universität Braunschweig · Infineon
  2. CICC
    2026
    A Fully Integrated 0.25Vpp-to-44Vpp 249 Level THD+N=0.3% Ultrasonic MEMS-Driver with a Power Reduction Factor of 22
    DOI
    Moritz Gruber, Björn Eversmann, Lei Liao, Ralf Brederlow
    Infineon · Technical University of Munich
  3. JSSC
    2026
    A Fully Integrated Bipolar Single-Ended Switched-Capacitor MEMS Driver With Voltage Boost and Energy Recovery
    DOI
    Moritz Gruber, Björn Eversmann, Lei Liao, Ralf Brederlow
    Technical University of Munich · Infineon
  4. JSSC
    2026
    A Low Jitter and Low Spur Fractional-N Digital PLL Based on a DTC Chopping Technique
    DOI
    Riccardo Moleri, Simone M. Dartizio, Michele Rossoni, Giacomo Castoro, Francesco Tesolin, Dmytro Cherniak, Carlo Samori, Andrea L. Lacaita, Salvatore Levantino
    Politecnico di Milano · Infineon
  5. ESSERC
    2025
    A +/−25V Charge Pump with Switchable Polarity in 3.3V CMOS Technology
    DOI
    Valentyn Solomko, Semen Syroiezhin, Ting-Li Hsu, Amelie Hagelauer
    Infineon · Technical University of Munich
  6. ISSCC
    2025
    The Crucial Role of Semiconductors in the Software-Defined Vehicle
    DOI
    Peter Schiefer
    Infineon
  7. VLSI
    2025
    A Fully Integrated Bipolar 1.8Vpp-to-41Vpp 450kHz Switched-Capacitor MEMS-Driver with a Power Reduction Factor of 16.3
    DOI
    Moritz Gruber, Björn Eversmann, Lei Liao, Ralf Brederlow
    Infineon · Technical University of Munich
  8. ESSERC
    2024
    A Low-Power Cryogenic Analog Electrode Signal Processing Unit for Shuttling Operations in a Trapped-Ion Quantum Computer
    DOI
    Alexander Meyer, Zhaoqun Guo, Marius Neumann, Paul Julius Ritter, Jens Repp, Matthias Brandl, Meinhard Schilling, Vadim Issakov
    Technische Universität Braunschweig · Infineon
  9. JSSC
    2024
    A 22-dBA Digital Optical MEMS Microphone
    DOI
    Niccolò de Milleri, Luca Valli, Marc Fueldner, Andreas Wiesbauer, Andrea Baschirotto
    Infineon · University of Milano-Bicocca · Infineon
  10. ESSERC
    2023
    A 125dBSPL 1%-THD, 115μA MEMS Microphone Using Passive Pre-Distortion Technique
    DOI
    Miodrag Nikolić, Wilfried Florian, Richard Gaggl, Lei Liao
    Infineon · Infineon
  11. JSSC
    2023
    A 117.5–155-GHz SiGe ×12 Frequency Multiplier Chain With Push-Push Doublers and a Gilbert Cell-Based Tripler
    DOI
    Justin Romstadt, Ahmad Zaben, Hakan Papurcu, Pascal Stadler, Tobias Welling, Klaus Aufinger, Nils Pohl
    Ruhr University Bochum · Infineon · Fraunhofer Institute for High Frequency Physics and Radar Techniques
  12. ESSERC
    2022
    A Full D-band Multi-Gbit RF-DAC in 90 nm SiGe BiCMOS based on Passive Vector Aggregation
    DOI
    Tim Maiwald, Akshay Visweswaran, Klaus Aufinger, Robert Weigel
    Friedrich-Alexander-Universität Erlangen-Nürnberg · IMEC · Infineon
  13. ESSERC
    2022
    High-Voltage CMOS RF Switch with Active Biasing
    DOI
    Valentyn Solomko, Semen Syroiezhin, Danial Tayari, Jochen Essel, Robert Weigel
    Infineon · Friedrich-Alexander-Universität Erlangen-Nürnberg
  14. ESSERC
    2022
    Semiconductors take the driver's seat - challenges and opportunities for the car of the future
    DOI
    Tim Gutheit
    Infineon
  15. ESSERC
    2022
    Switching Time Acceleration for High-Voltage CMOS RF Switch
    DOI
    Semen Syroiezhin, Oguzhan Oezdamar, Robert Weigel, Valentyn Solomko
    Friedrich-Alexander-Universität Erlangen-Nürnberg · Infineon