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VLSI · 2022–2026 LIVE

KU Leuven

対象論文Papers 8 · 筆頭著者first author 8 · 著者按分fractional 5.54 · 世界World #27

所属著者Affiliated authors

ORCID が一致する著者は同一人物としてまとめています。それ以外は表記ごとに別人として扱います。Authors sharing an ORCID are merged; other spellings are listed separately.

順位Rank著者Author論文数Papers
1Georges Gielen ORCID3
2Filip Tavernier ORCID2
2Kris Myny ORCID2
2Marian Verhelst ORCID2
2Mark Daniel Alea2
2Mohit Dandekar2
2Vikram Jain ORCID2
8Ali Safa1
8Athanasios Ramkaj1
8Chao Fang ORCID1
8Francky Catthoor1
8Jacques Van Damme1
8Jaro De Roose ORCID1
8Jeroen Verjauw1
8Linyan Mei ORCID1
8Man Shi ORCID1
8Maria Atalaia Rosa1
8Michiel Steyaert ORCID1
8Rohith Acharya1
8Sebastian Giraldo1
8Tuur Van Daele ORCID1
8Weijie Jiang ORCID1
8Wim Dehaene ORCID1
8Yari Nowicki1

対象論文Papers

  1. VLSI
    2025
    A 16NM 550-1320 BTOPS/W NPU Exploiting Training-Free Structured Bit-Level Sparsity and Dynamic Dataflow Processing
    DOI
    Man Shi, Chao Fang, Weijie Jiang, Vikram Jain, Antony Joseph, Wim Dehaene, Marian Verhelst
    KU Leuven · NXP
  2. VLSI
    2025
    An N-Type-Only a-IGZO Thin-Film-Transistor Based Nyquist-Rate 8-bit CDAC+SAR ADC Consuming 1.7mW at 32ksps and Achieving 44dB SNDR
    DOI
    Mohit Dandekar, Kris Myny
    KU Leuven
  3. VLSI
    2025
    DERMIS: A Flexible Fully-Integrated $\mathbf{6 0 0} \bm{\mu} \mathbf{m}$-Resolution Per-Taxel Slip-to-Spikes Tactile Sensor Readout on A-IGZO TFT for Large-Area High-Density Electronic Skins
    DOI
    Mark Daniel Alea, Maria Atalaia Rosa, Yari Nowicki, Mohit Dandekar, Kris Myny, Georges Gielen
    KU Leuven
  4. VLSI
    2023
    A Fingertip-Mimicking 12×16 200μm-Resolution e-skin Taxel Readout Chip with per-Taxel Spiking Readout and Embedded Receptive Field Processing
    DOI
    Mark Daniel Alea, Ali Safa, Flavio Giacomozzi, Andrea Adami, Inci Rüya Temel, Leandro Lorenzelli, Georges Gielen
    KU Leuven · IMEC · Fondazione Bruno Kessler
  5. VLSI
    2023
    A Fully Integrated 230 VRMS-to-12 VDC AC-DC Converter Achieving 9 mW/mm2
    DOI
    Tuur Van Daele, Filip Tavernier
    KU Leuven
  6. VLSI
    2022
    A 30GHz-BW < -57dB-IM3 Direct RF Receiver Analog Front End in 16nm FinFET
    DOI
    Athanasios Ramkaj, Adalberto Cantoni, Gabriele Manganaro, Siddharth Devarajan, Michiel Steyaert, Filip Tavernier
    Stanford University · KU Leuven · Analog Devices
  7. VLSI
    2022
    Scalable 1.4 μW cryo-CMOS SP4T multiplexer operating at 10 mK for high-fidelity superconducting qubit measurements
    DOI
    Rohith Acharya, Anton Potocnik, Steven Brebels, Alexander Grill, Jeroen Verjauw, Tsvetan Ivanov, Daniel Perez Lozano, Danny Wan, Fahd A. Mohiyaddin, Jacques Van Damme, A. M. Vadiraj, Massimo Mongillo, Georges Gielen, Francky Catthoor, Jan Craninckx, Iuliana P. Radu, Bogdan Govoreanu
    IMEC · KU Leuven
  8. VLSI
    2022
    TinyVers: A 0.8-17 TOPS/W, 1.7 μW-20 mW, Tiny Versatile System-on-chip with State-Retentive eMRAM for Machine Learning Inference at the Extreme Edge
    DOI
    Vikram Jain, Sebastian Giraldo, Jaro De Roose, Bert Boons, Linyan Mei, Marian Verhelst
    KU Leuven