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大学University · ベルギーBelgium · 2022–2026 LIVE

KU Leuven

世界World 14位 (6 pt) · 対象論文Papers 78

年別の推移Papers per year

会議・論文誌別の論文数（フルカウント）Papers per venue (full count)

05101520252022 ISSCC: 32022 VLSI: 32022 JSSC: 42022 CICC: 32022 A-SSCC: 12022 ESSERC: 72120222023 ISSCC: 32023 VLSI: 22023 JSSC: 62023 CICC: 12023 ESSERC: 31520232024 JSSC: 82024 CICC: 22024 ESSERC: 61620242025 ISSCC: 12025 VLSI: 32025 JSSC: 72025 ESSERC: 11220252026 ISSCC: 22026 JSSC: 102026 CICC: 2142026
ISSCCVLSIJSSCCICCA-SSCCESSERC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC33–12
VLSI32–3–
JSSC468710
CICC312–2
A-SSCC1––––
ESSERC7361–

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 1974.18世界World #38
VLSI Tier 1885.54世界World #27
JSSC Tier 1353224.12世界World #15
CICC Tier 2845.35世界World #28
A-SSCC Tier 2111.00世界World #71
ESSERC Tier 2171513.27世界World #4

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. CICC
    2026
    EinChip: A 4.6/1.5 TOPS/W 6/24b Log-compute Einsum-based Accelerator for Neuro Symbolic AI
    DOI
    Lingyun Yao, Shirui Zhao, Marian Verhelst, Martin Andraud
    Aalto University · KU Leuven
  2. CICC
    2026
    STELLA: A 16nm Spatio-Temporal Elastic Low-Latency CGRA for Multi-Stage Pipelined Applications
    DOI
    Jun Yin, Chao Fang, Ryan Antonio, Xiaoling Yi, Yunhao Deng, Fanchen Kong, Marian Verhelst
    KU Leuven
  3. ISSCC
    2026
    25.3 A 16nm 0.042mm 2 0.66μJ/Ops Lightweight MLWE PQC KEM with Cryptanalysis-ASIC Co-Optimization
    DOI
    Archisman Ghosh, Ming-Che Li, Lingke Ding, Suparna Kundu, Abdullah Sayeed, Angshuman Karmakar, Harshit Naman, Sarthak Antal, Ingrid Verbauwhede, Shreyas Sen
    Purdue University West Lafayette · KU Leuven · Indian Institute of Technology Kanpur
  4. ISSCC
    2026
    29.3 A 256-Channel Event-Driven Readout for Solid-State Nanopore Single-Molecule Sensing with 193pArms Noise in a 1MHz Bandwidth
    DOI
    Sander Crols, Carolina Mora Lopez, Filip Tavernier, Marian Verhelst, Nick Van Helleputte
    KU Leuven · IMEC
  5. JSSC
    2026
    A 0.5-/0.95-dB NF, 50-/25-Ω Configurable CMOS Front-End ASIC for the Readout of Liquid Argon Calorimeter in the LHC
    DOI
    Mietek Dabrowski, Filip Tavernier, Paul Leroux
    Brookhaven National Laboratory · KU Leuven
  6. JSSC
    2026
    A 200-MHz-BW 163-dB-FoM VCO-Based MASH 3-1 ΔΣ ADC With All-Pass-Filtering Gm- C Integrator in 16-nm FinFET
    DOI
    Xinfa Zheng, Qiuyang Lin, Xinpeng Xing, Georges Gielen
    KU Leuven · IMEC · Sun Yat-sen University
  7. JSSC
    2026
    A 240-/255-GHz High-Efficiency Fundamental Differential Oscillator Based on Ring Oscillator Theory in 22-nm FDSOI
    DOI
    Yue Liang, Qin Chen, Xujun Ma, Xu Wu, Xiangning Fan, Patrick Reynaert, Lianming Li
    Nanjing University of Posts and Telecommunications · Southeast University · Institut Polytechnique de Paris · KU Leuven
  8. JSSC
    2026
    A 256-Channel Solid-State Nanopore Readout Array With 193-pA TIAs and Event Detection at 1-MHz in 65-nm CMOS
    DOI
    Sander Crols, Filip Tavernier, Carolina Mora Lopez, Marian Verhelst, Nick Van Helleputte
    KU Leuven · IMEC
  9. JSSC
    2026
    A 34 Gb/s 5 m DSP-Free PMF Active Cable in 22 nm FDSOI CMOS
    DOI
    Dragan Simic, Gabriel Guimaraes, Valdrin Qunaj, Joren Vaes, Pieter-Antonio Fernandez, Patrick Reynaert
    KU Leuven
  10. JSSC
    2026
    A 77-dB DR Two-Stage SAR ADC for Low-Gain Analog Front-Ends Using Asynchronous Pipelining and RC Snubber Reference Stabilization
    DOI
    Jun Feng, Rares Bodnar, Roberto Maurino, Marcel J. M. Pelgrom, Filip Tavernier
    KU Leuven · Analog Devices
  11. JSSC
    2026
    Design and Implementation of 280-GHz Non-Coherent ASK TX–RX Chipsets in 16-nm FinFET CMOS
    DOI
    Berke Gungor, Patrick Reynaert
    KU Leuven
  12. JSSC
    2026
    EMEP: Early-Monitoring Error Prediction for Activity and Variability Resilience in a 28-nm RISC-V Controller
    DOI
    Clara Nieto Taladriz, Wim Dehaene
    KU Leuven
  13. JSSC
    2026
    HEMAIA: A 16 nm Heterogeneous Multi-Accelerator SoC With Accelerator-Centric Execution
    DOI
    Ryan Antonio, Xiaoling Yi, Jun Yin, Ce Ma, Yunhao Deng, Fanchen Kong, Abdelrahman Ayman Fathallah, Joren Dumoulin, Josse van Delm, Tiago Knorst, Adrian Kneip, Guilherme Paim, Wim Dehaene, Marian Verhelst
    KU Leuven · Universidade Federal do Rio Grande do Sul · Delft University of Technology · Instituto Superior Técnico
  14. JSSC
    2026
    SparseCol: A 1320 BTOPS/W Precision-Scalable NPU Exploiting Training-Free Structured Bit-Level Sparsity and Dynamic Dataflow
    DOI
    Man Shi, Vikram Jain, Weijie Jiang, Chao Fang, Antony Joseph, Wim Dehaene, Marian Verhelst
    KU Leuven · NXP
  15. ESSERC
    2025
    A 200MS/s, 77dB-DR Two-Stage SAR ADC with Asynchronous Pipelining and Reference Snubbers
    DOI
    Jun Feng, Rares Bodnar, Filip Tavernier
    KU Leuven
  16. ISSCC
    2025
    18.8 A Cryo-CMOS 800MS/s 7b CI-SAR with only 4fF Input Capacitance and 64dB SFDR
    DOI
    Bram Veraverbeke, Filip Tavernier
    KU Leuven
  17. JSSC
    2025
    A 1.8-V GPIO With Design-Technology-Reliability Co-Optimization in Sub-3-nm GAA-NS Technology
    DOI
    Wen-Chieh Chen, Shih-Hung Chen, Man-Ching Huang, Shu-Wei Chang, Geert Hellings, Guido Groeseneken
    KU Leuven · IMEC
  18. JSSC
    2025
    A 12-nm High-Density Energy-Efficient 1-Mb 2R2W Scratchpad With Local Blocks for Neural Network Applications
    DOI
    Hao Zhang, Weifeng He, Wim Dehaene
    KU Leuven · Shanghai Jiao Tong University
  19. JSSC
    2025
    A Cryo-CMOS 800-MS/s 7-bit Charge-Injection SAR ADC With Only 4-fF Input Capacitance and 64-dB SFDR in 40-nm Bulk CMOS
    DOI
    Bram Veraverbeke, Filip Tavernier
    KU Leuven
  20. JSSC
    2025
    AIA: A Customized Multi-Core RISC-V SoC for Discrete Sampling Workloads in 16 nm
    DOI
    Shirui Zhao, Nimish Shah, Wannes Meert, Marian Verhelst
    KU Leuven
  21. JSSC
    2025
    Fully Integrated Optical Injection Locking With Schottky Photodiodes in 65-nm CMOS
    DOI
    Arnaud Van Mieghem, Michiel Steyaert, Filip Tavernier
    KU Leuven
  22. JSSC
    2025
    HUNBN, a 16-nm Digital In-Memory-Compute SoC for Edge CNN Application Achieving 24 TOPs/W (4b) at System Level
    DOI
    Weijie Jiang, Cédric Caron, Prabhat Avasare, Marc Pauwels, Marian Verhelst, Wim Dehaene
    KU Leuven · Sony
  23. JSSC
    2025
    How to Keep Pushing ML Accelerator Performance? Know Your Rooflines!
    DOI
    Marian Verhelst, Luca Benini, Naveen Verma
    KU Leuven · ETH Zurich · Princeton University
  24. VLSI
    2025
    A 16NM 550-1320 BTOPS/W NPU Exploiting Training-Free Structured Bit-Level Sparsity and Dynamic Dataflow Processing
    DOI
    Man Shi, Chao Fang, Weijie Jiang, Vikram Jain, Antony Joseph, Wim Dehaene, Marian Verhelst
    KU Leuven · NXP
  25. VLSI
    2025
    An N-Type-Only a-IGZO Thin-Film-Transistor Based Nyquist-Rate 8-bit CDAC+SAR ADC Consuming 1.7mW at 32ksps and Achieving 44dB SNDR
    DOI
    Mohit Dandekar, Kris Myny
    KU Leuven
  26. VLSI
    2025
    DERMIS: A Flexible Fully-Integrated $\mathbf{6 0 0} \bm{\mu} \mathbf{m}$-Resolution Per-Taxel Slip-to-Spikes Tactile Sensor Readout on A-IGZO TFT for Large-Area High-Density Electronic Skins
    DOI
    Mark Daniel Alea, Maria Atalaia Rosa, Yari Nowicki, Mohit Dandekar, Kris Myny, Georges Gielen
    KU Leuven
  27. CICC
    2024
    Advanced Sensing Systems Exploiting the Integration of Flexible and Large-Area TFTs with Si-CMOS Technology
    DOI
    Marco Fattori, Enrico Genco, Carmine Garripoli, Mohammad Zulqarnain, Kris Myny, Eugenio Cantatore
    Eindhoven University of Technology · NXP · KU Leuven
  28. CICC
    2024
    An 80MS/s 70.79dB-SNDR 60.7fJ/Conv-Step Radiation-Tolerant Semi-Time-interleaved Pipelined-SAR ADC
    DOI
    Zheyi Li, Laurent Berti, Qiuyang Lin, Jinghao Zhao, Maxim Gorbunov, Geert Thys, Paul Leroux
    KU Leuven
  29. ESSERC
    2024
    A 170mV-to-1.8V Input Voltage Range DC-DC Boost Converter Using a 100nH Air-coil with Sub-μA Quiescent Current
    DOI
    Wenxiang Yu, Stefano Stanzione, Christina Avdikou, Chris Van Hoof, Georges Gielen, Nick Van Helleputte
    KU Leuven · Holst Centre (Netherlands) · IMEC
  30. ESSERC
    2024
    A DC-coupled Active Balun with 28 GHz Bandwidth and 0.3 dB-3.5°Amplitude - Phase Error in 40-nm CMOS
    DOI
    Berke Gungor, Patrick Reynaert
    KU Leuven
  31. ESSERC
    2024
    AIA: A 16nm Multicore SoC for Approximate Inference Acceleration Exploiting Non-normalized Knuth-Yao Sampling and Inter-Core Register Sharing
    DOI
    Shirui Zhao, Nimish Shah, Wannes Meert, Marian Verhelst
    KU Leuven
  32. ESSERC
    2024
    An Envelope-Detectable Single-Sideband Receiver for Non-Coherent Dielectric Waveguide Communication in 22-nm FDSOI
    DOI
    Kristof Dens, Patrick Reynaert
    KU Leuven
  33. ESSERC
    2024
    HUNBN, a 1.77MB Digital In-Memory-Compute SoC for edge applications achieving 126 TOPs/W (4b) at macro level and 24 TOPs/W at SoC level.
    DOI
    Weijie Jiang, Cedric Caron, Prabhat Avasare, Marc Pauwels, Marian Verhelst, Wim Dehaene
    KU Leuven
  34. ESSERC
    2024
    Optical Injection-Locked Oscillator With Integrated Schottky Photodiode in 65 nm CMOS
    DOI
    Arnaud Van Mieghem, Michiel Steyaert, Filip Tavernier
    KU Leuven
  35. JSSC
    2024
    A Dual-Inductor Ladder Buck Converter for Li-Ion Battery-Operated Sub-Volt SoCs
    DOI
    Arindam Mishra, Wei Zhu, Bernhard Wicht, Valentijn De Smedt
    KU Leuven · Leibniz University Hannover
  36. JSSC
    2024
    A Fully Integrated 135-GHz Direct-Digital 16-QAM Wireless and Dielectric Waveguide Link in 28-nm CMOS
    DOI
    Carl D’heer, Patrick Reynaert
    KU Leuven
  37. JSSC
    2024
    An Ultrasonic Driver Array in Metal-Oxide Thin-Film Technology Using a Hybrid TFT-Si DLL Locking Architecture
    DOI
    Jonas Pelgrims, Kris Myny, Wim Dehaene
    KU Leuven · IMEC
  38. JSSC
    2024
    Analysis and Comparison of Logic Architectures for Digital Circuits in a-IGZO Thin-Film Transistor Technologies
    DOI
    Hikmet Çeliker, Florian De Roose, Myriam Willegems, Steve Smout, Wim Dehaene, Kris Myny
    IMEC · KU Leuven
  39. JSSC
    2024
    Analysis and Design of a 10.4-ENOB 0.92–5.38-μW Event-Driven Level-Crossing ADC With Adaptive Clocking for Time-Sparse Edge Applications
    DOI
    Jonah Van Assche, Georges Gielen
    KU Leuven
  40. JSSC
    2024
    Design of a Noncoherent 100-Gb/s 3-m Dual-Band PAM-4 Dielectric Waveguide Link in 28-nm CMOS
    DOI
    Kristof Dens, Joren Vaes, Christian Bluemm, Gabriel Guimaraes, Berke Gungor, Changsong Xie, Alexander Dyck, Patrick Reynaert
    KU Leuven · Huawei
  41. JSSC
    2024
    Monolithic 230-VRMS-to-12-VDC AC–DC Converter at 9 mW/mm2 Enabled by a 31–325-VDC Input Range Capacitive Multi-Ratio DC–DC Converter
    DOI
    Tuur Van Daele, Filip Tavernier
    KU Leuven
  42. JSSC
    2024
    Thin-Film Transistor-Based Sensor Interface Circuits Enabling Distributed Local In-Module Solar Cell Temperature Monitoring
    DOI
    Seyed Mojtaba Sadati Faramarzi, Bin Luo, Jef Poortmans, Jan Genoe, Kris Myny
    IMEC · KU Leuven · Hasselt University
  43. CICC
    2023
    A 44V Driver Array for Ultrasonic Haptic Feedback in Display Compatible Thin-Film Low Temperature Poly-Silicon
    DOI
    Jonas Pelgrims, Kris Myny, Wim Dehaene
    KU Leuven
  44. ESSERC
    2023
    A 10 GHz Quadruple-Tail Comparator with Double Feedforward Paths and Minimal Delay Slope in 28 nm CMOS
    DOI
    Zongyuan Li, Filip Tavernier
    KU Leuven
  45. ESSERC
    2023
    A 16nm 128kB high-density fully digital In Memory Compute macro with reverse SRAM pre-charge achieving 0.36TOPs/mm2, 256kB/mm2 and 23. 8TOPs/W
    DOI
    Weijie Jiang, Pouya Houshmand, Marian Verhelst, Wim Dehaene
    KU Leuven
  46. ESSERC
    2023
    A 2Mbit Digital in-Memory Computing Matrix-Vector Multiplier for DNN Inference supporting flexible bit precision and matrix size achieving 612 binary TOPS/W
    DOI
    Mohit Gupta, Stefan Cosemans, Peter Debacker, Wim Dehaene
    IMEC · KU Leuven
  47. ISSCC
    2023
    1.3 EU Ships Act Drives Pan-European Full-Stack Innovation Partnerships
    DOI
    Jo De Boeck, Jean-René Lèquepeys, Christoph Kutter
    IMEC · KU Leuven · Commissariat à l'Énergie Atomique et aux Énergies Alternatives · CEA Grenoble · Laboratoire d'Électronique des Technologies de l'Information · Universität der Bundeswehr München · Fraunhofer Research Institution for Microsystems and Solid State Technologies · Bundeswehr
  48. ISSCC
    2023
    18.4 A $4\times 4$ 607GHz Harmonic Injection-Locked Receiver Array Achieving $4.4\text{pW}/\surd\text{Hz}$ NEP in 28nm CMOS
    DOI
    Ariane De Vroede, Patrick Reynaert
    KU Leuven
  49. ISSCC
    2023
    A 384-Channel Online-Spike-Sorting IC Using Unsupervised Geo-OSort Clustering and Achieving 0.0013mm2/Ch and $1.78\mu \text{W/ch}$
    DOI
    Yingping Chen, Bernardo Tacca, Yunzhu Chen, Dwaipayan Biswas, Georges Gielen, Francky Catthoor, Marian Verhelst, Carolina Mora Lopez
    Fudan University · IMEC · KU Leuven
  50. JSSC
    2023
    A 334 μW 0.158 mm2 ASIC for Post-Quantum Key-Encapsulation Mechanism Saber With Low-Latency Striding Toom–Cook Multiplication
    DOI
    Archisman Ghosh, Jose Maria Bermudo Mera, Angshuman Karmakar, Debayan Das, Santosh Ghosh, Ingrid Verbauwhede, Shreyas Sen
    Purdue University West Lafayette · PQShield (United Kingdom) · KU Leuven · Indian Institute of Technology Kanpur · Intel
  51. JSSC
    2023
    An Online-Spike-Sorting IC Using Unsupervised Geometry-Aware OSort Clustering for Efficient Embedded Neural-Signal Processing
    DOI
    Yingping Chen, Bernardo Tacca, Yunzhu Chen, Dwaipayan Biswas, Georges Gielen, Francky Catthoor, Marian Verhelst, Carolina Mora Lopez
    Fudan University · IMEC · KU Leuven
  52. JSSC
    2023
    DIANA: An End-to-End Hybrid DIgital and ANAlog Neural Network SoC for the Edge
    DOI
    Pouya Houshmand, Giuseppe M. Sarda, Vikram Jain, Kodai Ueyoshi, Ioannis A. Papistas, Man Shi, Qilin Zheng, Debjyoti Bhattacharjee, Arindam Mallik, Peter Debacker, Diederik Verkest, Marian Verhelst
    KU Leuven · IMEC
  53. JSSC
    2023
    DepFiN: A 12-nm Depth-First, High-Resolution CNN Processor for IO-Efficient Inference
    DOI
    Koen Goetschalckx, Fengfeng Wu, Marian Verhelst
    KU Leuven
  54. JSSC
    2023
    Fully Integrating a 400 V-to-12 V DC–DC Converter in High-Voltage CMOS
    DOI
    Tuur Van Daele, Filip Tavernier
    KU Leuven
  55. JSSC
    2023
    TinyVers: A Tiny Versatile System-on-Chip With State-Retentive eMRAM for ML Inference at the Extreme Edge
    DOI
    Vikram Jain, Sebastian Giraldo, Jaro De Roose, Linyan Mei, Bert Boons, Marian Verhelst
    KU Leuven
  56. VLSI
    2023
    A Fingertip-Mimicking 12×16 200μm-Resolution e-skin Taxel Readout Chip with per-Taxel Spiking Readout and Embedded Receptive Field Processing
    DOI
    Mark Daniel Alea, Ali Safa, Flavio Giacomozzi, Andrea Adami, Inci Rüya Temel, Leandro Lorenzelli, Georges Gielen
    KU Leuven · IMEC · Fondazione Bruno Kessler
  57. VLSI
    2023
    A Fully Integrated 230 VRMS-to-12 VDC AC-DC Converter Achieving 9 mW/mm2
    DOI
    Tuur Van Daele, Filip Tavernier
    KU Leuven
  58. A-SSCC
    2022
    A 90.6% Peak-Efficiency 1.5A Dual Inductor Ladder BuckConverter Achieving 0.93W/mm2 Active Peak Power Density for Li-ion Battery Operated PMICs
    DOI
    Arindam Mishra, Wei Zhu, Valentijn De Smedt
    KU Leuven
  59. CICC
    2022
    A 334uW 0.158mm2 Saber Learning with Rounding based Post-Quantum Crypto Accelerator
    DOI
    Archisman Ghosh, J.M.B. Mera, Angshuman Karmakar, Debayan Das, Santosh Ghosh, Ingrid Verbauwhede, Shreyas Sen
    Purdue University West Lafayette · KU Leuven · Intel
  60. CICC
    2022
    A 400-to-12 V Fully Integrated Switched-Capacitor DC-DC Converter Achieving 119 mW/mm2 at 63.6 % Efficiency
    DOI
    Tuur Van Daele, Filip Tavernier
    KU Leuven
  61. CICC
    2022
    Photoplethysmography (PPG) Sensor Circuit Design Techniques
    DOI
    Qiuyang Lin, Wim Sijbers, Christina Avidikou, Chris Van Hoof, Filip Tavernier, Nick Van Helleputte
    IMEC · KU Leuven
  62. ESSERC
    2022
    A 10.4-ENOB 0.92-5.38 μW Event-Driven Level-Crossing ADC with Adaptive Clocking for Time-Sparse Edge Applications
    DOI
    Jonah Van Assche, Georges Gielen
    KU Leuven
  63. ESSERC
    2022
    A 135 GHz 24 Gb/s Direct-Digital Demodulation 16-QAM Receiver in 28 nm CMOS
    DOI
    Carl D'heer, Patrick Reynaert
    KU Leuven
  64. ESSERC
    2022
    A 135 GHz 32 Gb/s Direct-Digital Modulation 16-QAM Transmitter in 28 nm CMOS
    DOI
    Carl D'heer, Patrick Reynaert
    KU Leuven
  65. ESSERC
    2022
    A 24V Thin-Film Ultrasonic Driver for Haptic Feedback in Metal-Oxide Thin-Film Technology using Hybrid DLL Locking Architecture
    DOI
    Jonas Pelgrims, Kris Myny, Wim Dehaene
    KU Leuven · IMEC
  66. ESSERC
    2022
    A D-Band mm-wave spectroscopy TX and RX in 28 nm CMOS with 15.6 dBm EIRP and 17.1 dB NF with integrated antennas
    DOI
    Gabriel Guimaraes, Patrick Reynaert
    KU Leuven
  67. ESSERC
    2022
    A monolithic SPAD-based random number generator for cryptographic application
    DOI
    Nicola Massari, Alessandro Tontini, Luca Parmesan, Matteo Perenzoni, Miloš Gruijć, Ingrid Verbauwhede, Thomas Strohm, Dayo Oshinubi, Ingo Herrmann, Andreas Brenneis
    Fondazione Bruno Kessler · IMEC · KU Leuven · Bosch
  68. ESSERC
    2022
    An Implantable Power Extraction Circuit with Integrated PMUTs for Wireless Power Delivery
    DOI
    Oi-Ying Wong, Dries Tabruyn, Veronique Rochus, Nick Van Helleputte
    IMEC · KU Leuven
  69. ISSCC
    2022
    A 256-Channel Actively-Multiplexed µECoG Implant with Column-Parallel Incremental $\Delta\Sigma$ ADCs Employing Bulk-DACs in 22-nm FDSOI Technology
    DOI
    Xiaohua Huang, Horacio Londoño-Ramírez, Marco Ballini, Chris Van Hoof, Jan Genoe, Sebastian Haesler, Georges Gielen, Nick Van Helleputte, Carolina Mora Lopez
    IMEC · KU Leuven · Neuroelectronics Research Flanders · Vlaams Instituut voor Biotechnologie
  70. ISSCC
    2022
    DIANA: An End-to-End Energy-Efficient Digital and ANAlog Hybrid Neural Network SoC
    DOI
    Kodai Ueyoshi, Ioannis A. Papistas, Pouya Houshmand, Giuseppe M. Sarda, Vikram Jain, Man Shi, Qilin Zheng, Sebastian Giraldo, Peter Vrancx, Jonas Doevenspeck, Debjyoti Bhattacharjee, Stefan Cosemans, Arindam Mallik, Peter Debacker, Diederik Verkest, Marian Verhelst
    KU Leuven · IMEC
  71. ISSCC
    2022
    Flex6502: A Flexible 8b Microprocessor in 0.8µm Metal-Oxide Thin-Film Transistor Technology Implemented with a Complete Digital Design Flow Running Complex Assembly Code
    DOI
    Hikmet Celiker, Antony Sou, Brian Cobb, Wim Dehaene, Kris Myny
    IMEC · KU Leuven · PragmatIC (United Kingdom)
  72. JSSC
    2022
    A 96.9-dB-Resolution 109-μW Second-Order Robust Closed-Loop VCO-Based Sensor Interface for Multiplexed Single-Ended Resistance Readout in 180-nm CMOS
    DOI
    Elisa Sacco, Johan Vergauwen, Georges Gielen
    KU Leuven · Melexis (Belgium)
  73. JSSC
    2022
    Actively Multiplexed μECoG Brain Implant System With Incremental-ΔΣ ADCs Employing Bulk-DACs
    DOI
    Xiaohua Huang, Horacio Londoño-Ramírez, Marco Ballini, Chris Van Hoof, Jan Genoe, Sebastian Haesler, Georges Gielen, Nick Van Helleputte, Carolina Mora Lopez
    IMEC · KU Leuven · Vlaams Instituut voor Biotechnologie · Neuroelectronics Research Flanders
  74. JSSC
    2022
    DPU: DAG Processing Unit for Irregular Graphs With Precision-Scalable Posit Arithmetic in 28 nm
    DOI
    Nimish Shah, Laura Isabel Galindez Olascoaga, Shirui Zhao, Wannes Meert, Marian Verhelst
    KU Leuven · University of California, Berkeley
  75. JSSC
    2022
    Design Margin Reduction Through Completion Detection in a 28-nm Near-Threshold DSP Processor
    DOI
    Roel Uytterhoeven, Wim Dehaene
    KU Leuven
  76. VLSI
    2022
    A 30GHz-BW < -57dB-IM3 Direct RF Receiver Analog Front End in 16nm FinFET
    DOI
    Athanasios Ramkaj, Adalberto Cantoni, Gabriele Manganaro, Siddharth Devarajan, Michiel Steyaert, Filip Tavernier
    Stanford University · KU Leuven · Analog Devices
  77. VLSI
    2022
    Scalable 1.4 μW cryo-CMOS SP4T multiplexer operating at 10 mK for high-fidelity superconducting qubit measurements
    DOI
    Rohith Acharya, Anton Potocnik, Steven Brebels, Alexander Grill, Jeroen Verjauw, Tsvetan Ivanov, Daniel Perez Lozano, Danny Wan, Fahd A. Mohiyaddin, Jacques Van Damme, A. M. Vadiraj, Massimo Mongillo, Georges Gielen, Francky Catthoor, Jan Craninckx, Iuliana P. Radu, Bogdan Govoreanu
    IMEC · KU Leuven
  78. VLSI
    2022
    TinyVers: A 0.8-17 TOPS/W, 1.7 μW-20 mW, Tiny Versatile System-on-chip with State-Retentive eMRAM for Machine Learning Inference at the Extreme Edge
    DOI
    Vikram Jain, Sebastian Giraldo, Jaro De Roose, Bert Boons, Linyan Mei, Marian Verhelst
    KU Leuven