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企業・研究機関Company / Institute · 中国China · 2022–2026 LIVE

MediaTek

中国China 8位 (25 pt) · 世界World 28位 (0 pt) · 対象論文Papers 9

年別の推移Papers per year

会議・論文誌別の論文数（フルカウント）Papers per venue (full count)

01232022 ISSCC: 12022 CICC: 1220222023 A-SSCC: 1120232024 ISSCC: 2220242025 ISSCC: 1120252026 ISSCC: 22026 JSSC: 132026
ISSCCJSSCCICCA-SSCC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC1–212
JSSC––––1
CICC1––––
A-SSCC–1–––

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 1621.44中国China #2 · 世界World #22
VLSI Tier 1000.00–
JSSC Tier 1100.36中国China #13 · 世界World #99
CICC Tier 2110.50中国China #6 · 世界World #22
A-SSCC Tier 2110.50中国China #7 · 世界World #25
ESSERC Tier 2000.00–

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. ISSCC
    2026
    10.2 A Dynamic Performance Augmentation in a 3nm-Plus Mobile CPU
    DOI
    Chien-Yu Lu, Bo-Jr Huang, Sung S.-Y. Hsueh, Trong-Hieu Tran, Eric Jia-Wei Fang, Chao-Yang Yeh, Quan Sun, Tao Chen, Hsinchen Chen, Huaichung Chang, C.-J. Tsai, Yi-Chang Zhuang, Barry Chen, Ericbill Wang, Hugh Mair, Shih-Arn Hwang
    MediaTek · MediaTek
  2. ISSCC
    2026
    15.2 A 350mV Single-Rail SRAM Using a Custom-Logic-Bitcell in 2nm-CMOS-Nanosheet Technology for Mobile and Edge-AI Applications
    DOI
    Manish Trivedi, Sandipan Sinha, Ramesh Halli, Girishankar Gurumurthy, Jaswinder Singh, Chun-Yuan Cheng, Linchien Chen, Jeff Lin, Hugh Mair
    MediaTek · MediaTek
  3. JSSC
    2026
    A Direct-Drive Monolithic O-Band Coherent Transmitter Based on Carrier-Injection Mode Mach–Zehnder Modulator
    DOI
    Antroy Roy Chowdhury, Wahid Rahman, Sunjin Choi, Ahmed ElShater, Yu-Tao Yang, Tamer Ali, Vladimir Stojanovic
    NVIDIA · MediaTek · MediaTek
  4. ISSCC
    2025
    8.2: Run-Time Power Management System by on-Die Power Sensor with Silicon Machine Learning-Based Calibration in a 3nm Octa-Core CPU
    DOI
    Chien-Yu Lu, Bo-Jr Huang, Min-Chieh Chen, Alfred Tsai, Eric Jia-Wei Fang, Yuju Cho, Rex Che-Yuan Liu, Ericbill Wang, You-Ming Tsao, Hugh Mair, Shih-Arn Hwang
    MediaTek · MediaTek
  5. ISSCC
    2024
    14.4 A Fully Digital Current Sensor Offering Per-Core Runtime Power for System Budgeting in a 4nm-Plus Octa-Core CPU
    DOI
    Chien-Yu Lu, Bo-Jr Huang, Min-Chieh Chen, Ollie Tsai, Alfred Tsai, Eric Jia-Wei Fang, Yuju Cho, Harry H. Chen, Ping Kao, Ericbill Wang, Hugh Mair, Shih-Arn Hwang
    MediaTek · MediaTek
  6. ISSCC
    2024
    2.1 A 4nm 3.4GHz Tri-Gear Fully Out-of-Order ARMv9.2 CPU Subsystem-Based 5G Mobile SoC
    DOI
    Anshul Varma, Sumanth Gururajarao, HsinChen Chen, Tao Chen, Gordon Gammie, Hugh Mair, Jen-Hang Yang, Hao-Hsiang Yu, Shun-Chieh Chang, Cheng-Hao Yang, Li-An Huang, Kumar Ramanathan, Ramesh Halli, Efron Ho, Ta-Wen Hung, Sung S.-Y. Hsueh, LiangChe Li, Achuta Thippana, Ericbill Wang, Sa Hwang
    MediaTek · MediaTek
  7. A-SSCC
    2023
    Semiconductor Chip Design in a Legoland
    DOI
    Chih-Ming Hung
    MediaTek · MediaTek
  8. CICC
    2022
    Design Techniques for High Linearity and Dynamic Range Digital to Analog Converters
    DOI
    Ayman Shabra, Yun-Shiang Shu, Shon-Hang Wen, Kuan-Dar Chen
    MediaTek · MediaTek
  9. ISSCC
    2022
    A 5nm 3.4GHz Tri-Gear ARMv9 CPU Subsystem in a Fully Integrated 5G Flagship Mobile SoC
    DOI
    Ashish Nayak, HsinChen Chen, Hugh Mair, Rolf Lagerquist, Tao Chen, Anand Rajagopalan, Gordon Gammie, Ramu Madhavaram, Madhur Jagota, CJ Chung, Jenny Wiedemeier, Bala Meera, Chao-Yang Yeh, Maverick Lin, Curtis Lin, Vincent Lin, Jiun Lin, YS Chen, Barry Chen, Cheng-Yuh Wu, Ryan ChangChien, Ray Tzeng, Kelvin Yang, Achuta Thippana, Ericbill Wang, SA Hwang
    MediaTek · MediaTek