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企業・研究機関Company / Institute · · 2022–2026 LIVE

Samsung

世界World 28位 (0 pt) · 対象論文Papers 16

年別の推移Papers per year

会議・論文誌別の論文数（フルカウント）Papers per venue (full count)

0123452022 ISSCC: 22022 JSSC: 12022 CICC: 12022 A-SSCC: 1520222023 JSSC: 22023 ESSERC: 1320232024 JSSC: 22024 CICC: 1320242025 ISSCC: 12025 JSSC: 12025 A-SSCC: 1320252026 JSSC: 222026
ISSCCJSSCCICCA-SSCCESSERC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC2––1–
JSSC12212
CICC1–1––
A-SSCC1––1–
ESSERC–1–––

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 1310.62世界World #42
VLSI Tier 1000.00–
JSSC Tier 1831.42世界World #23
CICC Tier 2200.27世界World #13
A-SSCC Tier 2210.54世界World #11
ESSERC Tier 2100.17世界World #41

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. JSSC
    2026
    A Fast-Settling mm-Wave LO With I/Q-Calibrated SSB Mixer and Frequency-Tuned ILO Filter Achieving Sub-ns Settling Time and −56 dBc Spur
    DOI
    Jaewon Oh, Cheol So, Hyojun Kim, Songcheol Hong, SeongHwan Cho
    Samsung · Samsung · University of California, Santa Barbara · Korea Aerospace Research Institute · Korea Advanced Institute of Science and Technology
  2. JSSC
    2026
    A Scalable 1024-Channel VCO-Based CTDSM MEA Readout IC Achieving High Yield and Reliability Through Slot-Partitioned Channel Redundancy
    DOI
    Hyeok-Ki Hong, Joonseong Kang, Byungsu Jung, Nahmil Koo, Seong-Joong Kim, Hankyu Lee, Dong-Jin Chang, Mikyung Kim, Junyeub Suh, Jonghan Kim, Takhyung Lee, Anes Ju, Jaechun Lee, Chang-Woo Shin, Kitae Park, Chisung Bae
    Samsung · Samsung · Dankook University · Chungnam National University
  3. A-SSCC
    2025
    A 1024-Channel VCO-Based CTDSM Neural Readout IC with Slot-Level Channel Replacement
    DOI
    Hyeok-Ki Hong, Joonseong Kang, Byungsu Jung, Nahmil Koo, Seong-Joong Kim, Hankyu Lee, Dong-Jin Chang, Mikyung Kim, Junyeub Suh, Jonghan Kim, Takhyung Lee, Anes Ju, Jaechun Lee, Chang-Woo Shin, Kitae Park, Chisung Bae
    Samsung · Samsung · Dankook University · Chungnam National University
  4. ISSCC
    2025
    37.3 Monolithic in-Memory Computing Microprocessor for End-to-End DNN Inferencing in MRAM-Embedded 28nm CMOS Technology with 1.1Mb Weight Storage
    DOI
    Soonwan Kwon, Sungmeen Myung, Jangho An, Hyunsoo Kim, Minje Kim, Hyungwoo Lee, Wooseok Yi, Seungchul Jung, Daekun Yoon, Shinhee Han, Saeyoon Chung, Kilho Lee, Jeong-Heon Park, Kangho Lee, Sang Joon Kim, Donhee Ham
    Samsung · Samsung
  5. JSSC
    2025
    An Analog Neuromorphic On-Chip Training System With IGZO TFT-Based 6T1C Synaptic Memory
    DOI
    Minil Kang, Minseong Um, Jongun Won, Jaehyeon Kang, Sangjun Hong, Narae Han, Sangwook Kim, Sangbum Kim, Hyung-Min Lee
    Korea University · Seoul National University · Samsung · Samsung
  6. CICC
    2024
    An Analog Neuromorphic On-Chip Training System with IGZO TFT-Based 6T1C 367-State Synaptic Memory Achieving 0.99-R2 Linearity and 104-Times Enhanced Retention Time
    DOI
    Minil Kang, Minseong Um, Jongun Won, Jaehyeon Kang, Sangjun Hong, Narae Han, Sangwook Kim, Sangbum Kim, Hyung-Min Lee
    Korea University · Seoul National University · Samsung · Samsung
  7. JSSC
    2024
    A 3.8-mW 1.9-mΩ/√Hz Electrical Impedance Tomography IC With High Input Impedance and Loading Effect Calibration for 3-D Early Breast Cancer Detect System
    DOI
    Soyeon Um, Jaehyuk Lee, Hoi-Jun Yoo
    Korea Advanced Institute of Science and Technology · Samsung · Samsung
  8. JSSC
    2024
    MACC-SRAM: A Multistep Accumulation Capacitor-Coupling In-Memory Computing SRAM Macro for Deep Convolutional Neural Networks
    DOI
    Bo Zhang, Jyotishman Saikia, Jian Meng, Dewei Wang, Soonwan Kwon, Sungmeen Myung, Hyunsoo Kim, Sang Joon Kim, Jae-Sun Seo, Mingoo Seok
    Columbia University · Arizona State University · Cornell Tech · Samsung · Samsung
  9. ESSERC
    2023
    A 3.8 mW 1.9 m Ω/√Hz Electrical Impedance Tomography Imaging with 28.4 M Ω High Input Impedance and Loading Calibration
    DOI
    Soyeon Um, Jaehyuk Lee, Hoi-Jun Yoo
    Korea Advanced Institute of Science and Technology · Samsung · Samsung
  10. JSSC
    2023
    A 43.3-μW Biopotential Amplifier With Tolerance to Common-Mode Interference of 18 V pp and T-CMRR of 105 dB in 180-nm CMOS
    DOI
    Nahmil Koo, Hyojun Kim, Seonghwan Cho
    Samsung · Samsung · Korea Aerospace Research Institute · Korea Advanced Institute of Science and Technology
  11. JSSC
    2023
    PIMCA: A Programmable In-Memory Computing Accelerator for Energy-Efficient DNN Inference
    DOI
    Bo Zhang, Shihui Yin, Minkyu Kim, Jyotishman Saikia, Soonwan Kwon, Sungmeen Myung, Hyunsoo Kim, Sang Joon Kim, Jae-Sun Seo, Mingoo Seok
    Columbia University · Huawei · Arizona State University · Qualcomm · Samsung · Samsung
  12. A-SSCC
    2022
    A Synchronous-Sampling Impedance-Readout IC with Baseline-Cancellation-Based Two-Step Conversion for Fast Neural Electrical Impedance Tomography
    DOI
    Ji-Hoon Suh, Haidam Choi, Yoontae Jung, Sein Oh, Hyungjoo Cho, Nahmil Koo, Seong Joong Kim, Chisung Bae, Sohmyung Ha, Minkyu Je
    Korea Advanced Institute of Science and Technology · Samsung · Samsung · New York University Abu Dhabi
  13. CICC
    2022
    A 177 TOPS/W, Capacitor-based In-Memory Computing SRAM Macro with Stepwise-Charging/Discharging DACs and Sparsity-Optimized Bitcells for 4-Bit Deep Convolutional Neural Networks
    DOI
    Bo Zhang, Jyotishman Saikia, Jian Meng, Dewei Wang, Soonwan Kwon, Sungmeen Myung, Hyunsoo Kim, Sang Joon Kim, Jae-sun Seo, Mingoo Seok
    Columbia University · Arizona State University · Samsung · Samsung
  14. ISSCC
    2022
    A 200 x 256 Image Sensor Heterogeneously Integrating a 2D Nanomaterial-Based Photo-FET Array and CMOS Time-to-Digital Converters
    DOI
    Henry Hinton, Houk Jang, Wenxuan Wu, Min-Hyun Lee, Minsu Seol, Hyeon-Jin Shin, Seongjun Park, Donhee Ham
    Harvard University · Samsung · Samsung
  15. ISSCC
    2022
    A Multi-Mode 8K-MAC HW-Utilization-Aware Neural Processing Unit with a Unified Multi-Precision Datapath in 4nm Flagship Mobile SoC
    DOI
    Jun-Seok Park, Changsoo Park, Suknam Kwon, Hyeong-Seok Kim, Taeho Jeon, Yesung Kang, Heonsoo Lee, Dongwoo Lee, James Kim, YoungJong Lee, Sangkyu Park, Jun-Woo Jang, SangHyuck Ha, MinSeong Kim, Jihoon Bang, Suk Hwan Lim, Inyup Kang
    Samsung · Samsung
  16. JSSC
    2022
    BitBlade: Energy-Efficient Variable Bit-Precision Hardware Accelerator for Quantized Neural Networks
    DOI
    Sungju Ryu, Hyungjun Kim, Wooseok Yi, Eunhwan Kim, Yulhwa Kim, Taesu Kim, Jae-Joon Kim
    Soongsil University · Pohang University of Science and Technology · Samsung · Seoul National University