TopSSCS
← 総合ランキングへ戻るBack to overall ranking

企業・研究機関Company / Institute · スイスSwitzerland · 2022–2026 LIVE

Swiss Center for Electronics and Microtechnology (Switzerland)

世界World 28位 (0 pt) · 対象論文Papers 7

年別の推移Papers per year

会議・論文誌別の論文数（フルカウント）Papers per venue (full count)

0122022 JSSC: 1120222023 VLSI: 1120232024 ISSCC: 12024 ESSERC: 1220242025 CICC: 1120252026 ISSCC: 12026 JSSC: 122026
ISSCCVLSIJSSCCICCESSERC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC––1–1
VLSI–1–––
JSSC1–––1
CICC–––1–
ESSERC––1––

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 1221.60世界World #52
VLSI Tier 1111.00世界World #48
JSSC Tier 1220.85世界World #66
CICC Tier 2111.00世界World #22
A-SSCC Tier 2000.00–
ESSERC Tier 2100.62世界World #41

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. ISSCC
    2026
    33.2 An Infinite-Loop CMOS-Compatible Isolator Enabled True VSWR-Resilient Power Amplifier for 6G FR3 in Massive MIMO and Phased-Array Systems
    DOI
    Mohsen Ghorbanpoor, Mohamed Eleraky, Konstantinos Manetakis, Pascal Nussbaum, Hua Wang
    Swiss Center for Electronics and Microtechnology (Switzerland) · ETH Zurich
  2. JSSC
    2026
    An Ultra-Low-Loss On-Chip Isolator Featuring Coupling-Engineered Non-Reciprocal Infinite-Loop Enabling a VSWR-Resilient Power Amplifier
    DOI
    Mohsen Ghorbanpoor, Mohamed Eleraky, Konstantinos Manetakis, Pascal Nussbaum, Hua Wang
    Swiss Center for Electronics and Microtechnology (Switzerland) · ETH Zurich
  3. CICC
    2025
    Multi-Electroanalytical Method Capable, Duty-Cycled, 0.36 mm2 Electrochemical Frontend, Achieving 170dB Current Sensing Range with Extended Compliance Voltage Adopting Feedforward Cancellation
    DOI
    A. Sukumaran, F. Caruso, R. Cattenoz, B. Putter, J-L. Nagel, R. Ravanilla, I. Stergiou, G. Bouilly, P. Nussbaum, S. Emery
    Swiss Center for Electronics and Microtechnology (Switzerland)
  4. ESSERC
    2024
    An Integrated MEMS Magnetic Gradiometer Rejecting Vibrations and Stray Fields
    DOI
    Enrico Gasparin, Arno Hoogerwerf, Dara Bayat, Guido Spinola Durante, Yves Petremand, Maurizio Tormen, Michel Despont, Gaël Close
    Moving Magnet Technologies (France) · Swiss Center for Electronics and Microtechnology (Switzerland)
  5. ISSCC
    2024
    23.2 A 1mm2 Software-Defined Dual-Mode Bluetooth Transceiver with 10dBm Maximum TX Power and -98.2dBm Sensitivity 2.96mW RX Power at 1Mb/s
    DOI
    Nicola Scolari, Franz X. Pengg, Konstantinos Manetakis, Camilo A. Salazar, Alexandre Vouilloz, Ernesto Pérez Serna, Anjana Dissanayake, Pascal Persechini, Vladimir Kopta, Erwan Le Roux, Francesco Chicco, Stefano Cillo, Nicola Gerber, Cédric Barbelenet, Fabio Epifano, Paulo A. Dal Fabbro, Nicolas Raemy
    Swiss Center for Electronics and Microtechnology (Switzerland)
  6. VLSI
    2023
    A 90 μW at 1 fps and 1.33 mW at 30 fps 120 dB intra-scene dynamic range 640 × 480 stacked image sensor for autonomous vision systems
    DOI
    P.-F. Rüedi, R. Quaglia, H.-R. Graf
    Swiss Center for Electronics and Microtechnology (Switzerland)
  7. JSSC
    2022
    A 2.4 GHz-91.5 dBm Sensitivity Within-Packet Duty-Cycled Wake-Up Receiver
    DOI
    Anjana Dissanayake, Henry L. Bishop, Steven M. Bowers, Benton H. Calhoun
    Swiss Center for Electronics and Microtechnology (Switzerland) · Amazon · University of Virginia