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大学University · ドイツGermany · 2022–2026 LIVE

Technical University of Munich

世界World 25位 (0 pt) · 対象論文Papers 11

年別の推移Papers per year

会議・論文誌別の論文数（フルカウント）Papers per venue (full count)

01234562022 ESSERC: 1120222023 ESSERC: 22202320242025 ISSCC: 12025 VLSI: 12025 ESSERC: 4620252026 JSSC: 12026 CICC: 122026
ISSCCVLSIJSSCCICCESSERC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC–––1–
VLSI–––1–
JSSC––––1
CICC––––1
ESSERC12–4–

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 1111.00世界World #112
VLSI Tier 1100.25世界World #78
JSSC Tier 1110.50世界World #189
CICC Tier 2100.25世界World #113
A-SSCC Tier 2000.00–
ESSERC Tier 2733.04世界World #19

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. CICC
    2026
    A Fully Integrated 0.25Vpp-to-44Vpp 249 Level THD+N=0.3% Ultrasonic MEMS-Driver with a Power Reduction Factor of 22
    DOI
    Moritz Gruber, Björn Eversmann, Lei Liao, Ralf Brederlow
    Infineon · Technical University of Munich
  2. JSSC
    2026
    A Fully Integrated Bipolar Single-Ended Switched-Capacitor MEMS Driver With Voltage Boost and Energy Recovery
    DOI
    Moritz Gruber, Björn Eversmann, Lei Liao, Ralf Brederlow
    Technical University of Munich · Infineon
  3. ESSERC
    2025
    A +/−25V Charge Pump with Switchable Polarity in 3.3V CMOS Technology
    DOI
    Valentyn Solomko, Semen Syroiezhin, Ting-Li Hsu, Amelie Hagelauer
    Infineon · Technical University of Munich
  4. ESSERC
    2025
    Including Package-Induced Mechanical Stress in Bandgap Reference Circuit Design
    DOI
    Carl Riehm, Tobias Chlan, Vartika Verma, Pengcheng Xu, Ralf Brederlow
    Technical University of Munich
  5. ESSERC
    2025
    Low-Latency Modulation- and Correlation-Adaptive ORBGRAND-AI Decoder
    DOI
    Zeynep Ece Kizilates, Arslan Riaz, Akshaya Bali, Moritz Grundei, Muriel Medard, Ken R. Duffy, Rabia Tugce Yazicigil
    Boston University · Technical University of Munich · Massachusetts Institute of Technology · Northeastern University
  6. ESSERC
    2025
    SENNA: An Ultra-Low Latency, Time-Deterministic Field-Programmable-Spiking-Neuron-Array (FPSNA)
    DOI
    Ferdinand Pscheidl, Elmar Herzer, Andreas Stoll, Leonidas Richter, Claudia Schuhmann, Stefan Köhler, Sebastian Ruping, Matthias Kampa, Ralf Brederlow, Johannes Leugering
    Fraunhofer Research Institution for Microsystems and Solid State Technologies · Fraunhofer Institute for Integrated Circuits · ZHAW Zurich University of Applied Sciences · Technical University of Munich · University of California San Diego
  7. ISSCC
    2025
    4.4 A 0.36nW/0.9V 32kHz Crystal Oscillator Using Analog Regulation for Cross-Current Avoidance
    DOI
    Tobias Chlan, Markus Dietl, Ralf Brederlow
    Technical University of Munich
  8. VLSI
    2025
    A Fully Integrated Bipolar 1.8Vpp-to-41Vpp 450kHz Switched-Capacitor MEMS-Driver with a Power Reduction Factor of 16.3
    DOI
    Moritz Gruber, Björn Eversmann, Lei Liao, Ralf Brederlow
    Infineon · Technical University of Munich
  9. ESSERC
    2023
    A 2.2 fA/√Hz, 120 dB Dynamic Range, 12 GΩ Hybrid Readout Interface for Various Ionic Spectroscopy Applications
    DOI
    Islam Mostafa, Eva-Maria Korek, Ralf Brederlow
    Technical University of Munich
  10. ESSERC
    2023
    A FeFET In-Memory-Computing Core with Offset Cancellation for Mitigating Computational Errors
    DOI
    Lei Zhang, Pengcheng Xu, David Borggreve, Frank Vanselow, Ralf Brederlow
    Fraunhofer Research Institution for Microsystems and Solid State Technologies · Technical University of Munich
  11. ESSERC
    2022
    Thermal switching of $\text{TiO}_{2}$ -based RRAM for parameter extraction and neuromorphic engineering
    DOI
    Alessandro Milozzi, Daniel Reiser, Andreas Drost, Thomas Neuner, Marc Tornow, Daniele Ielmini
    Politecnico di Milano · Fraunhofer Research Institution for Microsystems and Solid State Technologies · Technical University of Munich