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CICC · 2022–2026 LIVE

TSMC

対象論文Papers 2 · 筆頭著者first author 2 · 著者按分fractional 1.50 · 台湾Taiwan #1 · 世界World #13

所属著者Affiliated authors

ORCID が一致する著者は同一人物としてまとめています。それ以外は表記ごとに別人として扱います。Authors sharing an ORCID are merged; other spellings are listed separately.

順位Rank著者Author論文数Papers
1Chien-Chun Tsai2
1Mu-Shan Lin2
1Shenggao Li2
1Wei-Chih Chen2
5Hsin-Hung Kuo1
5Shu-Chun Yang1
5Yu-Jie Huang1

対象論文Papers

  1. CICC
    2025
    UCle-Compliant Chiplet Interconnect Design Leveraging Cutting-Edge Packaging Technologies
    DOI
    Yu-Jie Huang, Mu-Shan Lin, Chien-Chun Tsai, Wei-Chih Chen, Hsin-Hung Kuo, Shu-Chun Yang, Shenggao Li
    TSMC · TSMC
  2. CICC
    2022
    Interconnect in the Era of 3DIC
    DOI
    Shenggao Li, Mu-Shan Lin, Wei-Chih Chen, Chien-Chun Tsai
    TSMC