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CICC · 2022–2026 LIVE

TSMC

対象論文Papers 1 · 筆頭著者first author 1 · 著者按分fractional 0.50 · 中国China #6 · 世界World #22

所属著者Affiliated authors

ORCID が一致する著者は同一人物としてまとめています。それ以外は表記ごとに別人として扱います。Authors sharing an ORCID are merged; other spellings are listed separately.

順位Rank著者Author論文数Papers
1Chien-Chun Tsai1
1Hsin-Hung Kuo1
1Mu-Shan Lin1
1Shenggao Li1
1Shu-Chun Yang1
1Wei-Chih Chen1
1Yu-Jie Huang1

対象論文Papers

  1. CICC
    2025
    UCle-Compliant Chiplet Interconnect Design Leveraging Cutting-Edge Packaging Technologies
    DOI
    Yu-Jie Huang, Mu-Shan Lin, Chien-Chun Tsai, Wei-Chih Chen, Hsin-Hung Kuo, Shu-Chun Yang, Shenggao Li
    TSMC · TSMC