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企業・研究機関Company / Institute · 中国China · 2022–2026 LIVE

TSMC

中国China 9位 (20 pt) · 世界World 28位 (0 pt) · 対象論文Papers 5

年別の推移Papers per year

会議・論文誌別の論文数（フルカウント）Papers per venue (full count)

01220222023 VLSI: 1120232024 VLSI: 1120242025 ISSCC: 12025 CICC: 1220252026 JSSC: 112026
ISSCCVLSIJSSCCICC
数値表を表示Show table
会議・論文誌Venue20222023202420252026
ISSCC–––1–
VLSI–11––
JSSC––––1
CICC–––1–

会議・論文誌別By venue

順位はフルカウントでの値です。Ranks use the full count.

会議・論文誌VenueフルFull 筆頭First按分Frac. 順位Rank
ISSCC Tier 1100.11中国China #10 · 世界World #77
VLSI Tier 1200.26中国China #3 · 世界World #28
JSSC Tier 1100.14中国China #13 · 世界World #99
CICC Tier 2110.50中国China #6 · 世界World #22
A-SSCC Tier 2000.00–
ESSERC Tier 2000.00–

対象論文Papers

太字はこの機関の所属として確認できた著者です。Bold: authors affiliated with this institution.

  1. JSSC
    2026
    A 2.4-GS/s 7.5-MHz-BW 95.4-dB-DR CT 4× Time-Interleaved Second-Order DSM Achieving 0-dBFS-MSA With High Tolerance to ELD
    DOI
    Yuekai Liu, Ziqiang Cai, Jingying Zhang, Yichen Jin, Zhenzhen Tian, Guoxing Wang, Liang Qi
    Shanghai Jiao Tong University · TSMC
  2. CICC
    2025
    UCle-Compliant Chiplet Interconnect Design Leveraging Cutting-Edge Packaging Technologies
    DOI
    Yu-Jie Huang, Mu-Shan Lin, Chien-Chun Tsai, Wei-Chih Chen, Hsin-Hung Kuo, Shu-Chun Yang, Shenggao Li
    TSMC · TSMC
  3. ISSCC
    2025
    36.1 A 32Gb/s 10.5Tb/s/mm 0.6pJ/b UCIe-Compliant Low-Latency Interface in 3nm Featuring Matched-Delay for Dynamic Clock Gating
    DOI
    Mu-Shan Lin, Chien-Chun Tsai, Shenggao Li, Wei-Chih Chen, Wen-Hung Huang, Yu-Chi Chen, Yu-Jie Huang, Alan Drake, Chin-Hua Wen, Paul Ranucci, Hsin-Hung Kuo, Aidong Yin, Shu-Chun Yang, Farsheed Mahmoudi, Han-Tzung Ke, Chao-Chieh Li, Nai-Chen Cheng, Jimmy Wang, Kevin Lin, Harry Liao, Jie-Ren Huang, Meng-Hsuan Wu, Kenny Cheng-Hsiang Hsieh, Nicholas Amatruda, William Polanco, David King, Todd Basso, Anwar Kashem
    TSMC · TSMC · TSMC · AMD
  4. VLSI
    2024
    A 22nm Nonvolatile AI-Edge Processor with 21.4TFLOPS/W using 47.25Mb Lossless-Compressed-Computing STT-MRAM Near-Memory-Compute Macro
    DOI
    De-Qi You, Win-San Khwa, Jui-Jen Wu, Chuan-Jia Jhang, Guan-Yi Lin, Po-Jung Chen, Ting-Chien Chiu, Fang-Yi Chen, Andrew Lee, Yu-Cheng Hung, Chung-Chuan Lo, Ren-Shuo Liu, Chih-Cheng Hsieh, Kea-Tiong Tang, Yu-Der Chih, Tsung-Yung Jonathan Chang, Meng-Fan Chang
    National Tsing Hua University · TSMC · TSMC
  5. VLSI
    2023
    A 28nm Nonvolatile AI Edge Processor using 4Mb Analog-Based Near-Memory-Compute ReRAM with 27.2 TOPS/W for Tiny AI Edge Devices
    DOI
    Tai-Hao Wen, Je-Min Hung, Hung-Hsi Hsu, Yuan Wu, Fu-Chun Chang, Chung-Yuan Li, Chih-Han Chien, Chin-I Su, Win-San Khwa, Jui-Jen Wu, Chung-Chuan Lo, Ren-Shuo Liu, Chih-Cheng Hsieh, Kea-Tiong Tang, Mon-Shu Ho, Yu-Der Chih, Tsung-Yung Jonathan Chang, Meng-Fan Chang
    National Tsing Hua University · TSMC · TSMC · National Chung Hsing University